| Allicdata Part #: | ATS-01D-122-C1-R0-ND |
| Manufacturer Part#: |
ATS-01D-122-C1-R0 |
| Price: | $ 3.28 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X15MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01D-122-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.98368 |
| 30 +: | $ 2.90325 |
| 50 +: | $ 2.74201 |
| 100 +: | $ 2.58067 |
| 250 +: | $ 2.41940 |
| 500 +: | $ 2.33875 |
| 1000 +: | $ 2.09680 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.85°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is essential in many industries, as a wide range of electronics can be damaged if they get too hot. Heat sinks are essential components in this regard, as they provide a way to transfer heat away from an electronic device and ensure it operates in a safe temperature range. ATS-01D-122-C1-R0 is a popular thermal - heat sink with a wide range of applications and proven working principles.
The ATS-01D-122-C1-R0 heat sink is an all-in-one cooling solution, designed to provide effective and efficient heat dissipation for a large range of electronic components. Its low profile design makes it the ideal choice for applications with limited space, such as sealed enclosures, and its unique finned shape allows it to dissipate heat quickly and reliably. It is also compatible with a wide range of thermal paste solutions, which can be used to maximize thermal conductivity between the heat sink and the device it is attached to.
The ATS-01D-122-C1-R0 is designed to dissipate heat by convection, which is the process of heat transfer from one object to another through the air. The convection process works by drawing cooler air through the finned surface of the heat sink, which carries the heat away from the device and into the surrounding area. This is done by creating a ‘chimney’ effect, as the warm air rises away from the surface of the heat sink and is replaced by cooler air.
The ATS-01D-122-C1-R0 is an incredibly versatile heat sink, and its wide range of applications and compatibility make it an ideal solution for many tasks. It is often used in the manufacturing industry, as it is well-suited to being placed inside computer and industrial enclosures, transferring heat away from sensitive components and ensuring efficient operation. Additionally, it is also commonly found in consumer electronics, as it is a low-cost option for cooling CPUs, GPUs and other integrated components.
The ATS-01D-122-C1-R0 is an incredibly reliable thermal - heat sink, with a proven working principle and a wide range of applications. Its finned surface provides an efficient and effective way to dissipate heat, and its compatibility with thermal paste solutions maximizes the thermal conductivity between the heat sink and its mounted device. Its low profile design makes it perfect for applications with limited space, such as computer and industrial enclosures, and its versatility makes it a popular choice for a wide variety of tasks.
The specific data is subject to PDF, and the above content is for reference