| Allicdata Part #: | ATS-01E-153-C1-R0-ND |
| Manufacturer Part#: |
ATS-01E-153-C1-R0 |
| Price: | $ 3.45 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X10MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01E-153-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.13866 |
| 30 +: | $ 3.05361 |
| 50 +: | $ 2.88401 |
| 100 +: | $ 2.71435 |
| 250 +: | $ 2.54470 |
| 500 +: | $ 2.45987 |
| 1000 +: | $ 2.20541 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.93°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
AT-01E-153-C1-R0 is an essential component of thermal management and is a type of heat sink. Heat sink is a device that dissipate heat from a heatsource. This heat sink can be attached to a variety of heatsources, from processors to GPUs and other electronic components. It is designed to aid cooling by dissipating thermal energy away from the device.
As heat source temperatures increase, this heat sink increases the surface area for heat to be dissipated from the source. Bydesign, these heat sinks are made from aluminum to help dissipate the thermal energy as quickly as possible. This type of heat sink is typically teamed with fans to help maximize performance.
ATS-01E-153-C1-R0 relies on simple physics principles to work. Heat is transferred between objects that have different temperatures via conduction, convection, and radiation. Heat is transferred from the higher energy source (the heatsource) to the lower energy object (the heat sink). The heat sink works to absorb this heat, dissipate it to the air, or spread the heat even further away into another object that has a higher temperature.
The ATS-01E-153-C1-R0 is a high-performance, low-cost heat sink solution. It has an optimized fin design that maximizes the surface area of the heat dissipator to ensure efficiency. The fin design allows it to efficiently dissipate the thermal energy from the heatsource while the heat sink body helps to dissipate the heat evenly to the rest of the component. It can be easily stacked and supports mounting in various orientations.
The aluminum construction is resistant to oxidation, corrosion, and other benefits due to its anodizing process. ATS-01E-153-C1-R0 has an improved thermal performance with less heat at the hotspots. This allows it to dissipate heat quickly and quietly while avoiding thermal fatigue caused by localized heating.
ATS-01E-153-C1-R0 excels in a variety of applications such as general-purpose cooling; lasers; automotive or industrial heat sinks; high-performance CPUs; GPUs; electronics; aerospace; robotics and much more. The heat sink combines low-cost manufacturing and superior thermal performance. Its minimal footprint (<5W) also allows the flexibility to design the thermal solution into any size product design.
In conclusion, ATS-01E-153-C1-R0 is a heat sink solution with excellent thermal performance that offers excellent value and efficiency. Its anodized aluminum construction enhances the thermal transfer while its fin design maximizes the surface area to help quickly dissipate the thermal energy. Its versatile design and low profile allow it to work in a variety of applications and keep components cool and quiet.
The specific data is subject to PDF, and the above content is for reference