| Allicdata Part #: | ATS-01F-195-C3-R0-ND |
| Manufacturer Part#: |
ATS-01F-195-C3-R0 |
| Price: | $ 3.42 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X12MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01F-195-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.10275 |
| 30 +: | $ 3.01896 |
| 50 +: | $ 2.85125 |
| 100 +: | $ 2.68349 |
| 250 +: | $ 2.51579 |
| 500 +: | $ 2.43193 |
| 1000 +: | $ 2.18034 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.472" (12.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.12°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management has become increasingly important in modern electronics due to the ever-increasing heat generated by processors and other components. Heat Sinks are an integral part of effective thermal management, and the ATW-01F-195-C3-R0 is an example of an advanced heat sink designed for high reliability performance in harsh environments. In this article, we will discuss the application field and working principle of the ATW-01F-195-C3-R0.
The ATW-01F-195-C3-R0 is designed for applications in industrial, medical, military and aerospace markets. It is a highly efficient heat sink that is capable of dissipating up to 40 W of heat with a maximum airflow of 13.14 CFM. The heat sink has a base width of 1.75 inches and a height of 1.95 inches, making it suitable for use in tight spaces. The heat sink also features a radial fin design which increases the surface area for heat dissipation and allows for a more efficient performance.
The working principle of the ATW-01F-195-C3-R0 is straightforward. Heat is generated by the processor or other component and is transferred to the heat sink by conduction or convection. The heat is then dissipated into the surrounding environment by means of natural or forced convection. The fins of the heat sink increase the surface area of the heat sink, allowing for more efficient heat dissipation. The fins also allow for increased airflow through the heat sink, further increasing the heat dissipation rate.
The ATW-01F-195-C3-R0 is a reliable and efficient heat sink designed for use in a variety of applications. Its base width and height make it suitable for use in tight spaces, and its radial fin design increases the surface area for efficient heat dissipation. The heat sink is capable of dissipating up to 40 W of heat and is designed to operate in a variety of temperature ranges, making it suitable for use in a variety of industries. Its efficient design and reliable performance make it an ideal choice for a variety of thermal management applications.
The specific data is subject to PDF, and the above content is for reference