| Allicdata Part #: | ATS-02B-120-C3-R0-ND |
| Manufacturer Part#: |
ATS-02B-120-C3-R0 |
| Price: | $ 3.79 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02B-120-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.44736 |
| 30 +: | $ 3.35433 |
| 50 +: | $ 3.16802 |
| 100 +: | $ 2.98166 |
| 250 +: | $ 2.79531 |
| 500 +: | $ 2.70213 |
| 1000 +: | $ 2.42260 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.57°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
Thermal - Heat Sinks have become a major component used in cooling various electronic applications in many industries. The ATS-02B-120-C3-R0 is a specialized thermal - heat sink typically used in high-power applications and can play an essential role in helping to maintain a consistent working temperature in these applications. It is also used when placed adjacent to certain electronic components, such as resistors, to reduce their thermal resistance.
The ATS-02B-120-C3-R0 is an aluminum extrusion-style heat sink produced from aluminum billets, and it is designed with satin anodized surfaces and a thermally-conductive coating called "adhesive interface material" (AIM). It has a thickness of 120mm and can dissipate up to 204 watts of heat. The extruded fins of the ATS-02B-120-C3-R0 give it heightened performance, particularly in comparison to other conventional heat sinks.
The ATS-02B-120-C3-R0 is designed to be used in many different applications, but its primary use is for cooling microprocessors and other complex components in high-performance, heat-intensive systems. It can be used in applications found throughout the telecom, networking, aerospace, medical, and industrial industries. As such, it is often used in applications where reliability and performance are essential.
Since temperature is such an important factor in the performance of these components and systems, the ATS-02B-120-C3-R0 is designed with a number of features intended to ensure long-term reliability and consistent performance. It has fin extrusion with different fin profiles, which can optimize cooling efficiency, and it also offers the user multiple mounting options. These mounting options include through-hole or surface mounting, and both of these provide a secure connection that ensures the stability and reliability of heat sink performance.
The ATS-02B-120-C3-R0 also has a built-in copper core base, which increases thermal conductivity between the heat sink and the components that it is cooling. Additionally, the heat sink is made from aircraft grade aluminum which provides increased strength and corrosion resistance to ensure it will remain in good condition for many years.
The ATS-02B-120-C3-R0 offers high performance and reliability in many heat-intensive applications. Its combination of fin extrusion, mounting options, thermal conductivity, and corrosion resistance makes it an ideal choice for many different types of systems. When combined with a suitable fan for air movement, it can provide reliable cooling and temperature control for many complex electronic components.
The specific data is subject to PDF, and the above content is for reference