ATS-02D-27-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS4956-ND

Manufacturer Part#:

ATS-02D-27-C2-R0

Price: $ 7.71
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 70X70X12.7MM XCUT T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-02D-27-C2-R0 datasheetATS-02D-27-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 6.94260
10 +: $ 6.75486
25 +: $ 6.37963
50 +: $ 6.00440
100 +: $ 5.62918
250 +: $ 5.25390
500 +: $ 4.87862
1000 +: $ 4.78480
Stock 1000Can Ship Immediately
$ 7.71
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.756" (70.00mm)
Width: 2.756" (70.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.500" (12.70mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 12.24°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks are useful tools used to create heat dissipation, and are often used in electronics to help cool down components that generate a lot of heat from normal operation. One such device is the ATS-02D-27-C2-R0 Fins Heat Sink. This small but powerful heat sink is perfect for applications that need good cooling in tight spaces.

Specifically, the ATS-02D-27-C2-R0 heat sink is specifically designed for use with TO-220 packages which are found in semiconductors, integrated circuits, and other electrical components that produce lots of heat during use. Common applications include brushless DC motor drives, power amplifiers, variable-frequency intensity modulators, and LED lighting systems.

Features

This heat sink features a powder-coated aluminium body with zinc-plated steel mounting brackets that ensure secure attachment to whatever surface it is being applied to. Additionally, the fins on the heat sink have a high thermal dissipation area, allowing for more heat to be dissipated from the device at a faster rate and with more efficiency.

In addition, this particular heat sink has a 2.7mm thickness, a 27mm installation height and a 50mm fin area, allowing it to fit in even the tightest of spaces while providing optimal heat dissipation. The ATS-02D-27-C2-R0 also has a 0.45℃/W thermal resistance, meaning even in the most extreme situations, it will be able to quickly disperse heat away from the component in question.

Working Principle

The working principle of a heat sink is to dissipate heat away from the component in question by transferring the heat energy into a cooler medium such as air or liquid. Heat sinks achieve this by increasing the surface area of the device, allowing more heat to be conducted away from the device and preventing the device from overheating. The ATS-02D-27-C2-R0 heat sink does this by featuring metal fins, which create an increased surface area and allow heat to be conducted away from the component in question more effectively.

The increased surface area of the heat sink also helps to increase the air-flow around the device, allowing for even more efficient heat dissipation. Furthermore, the aluminium body of the ATS-02D-27-C2-R0 heat sink is a good conductor of electricity, allowing for optimal thermal transfer. This results in a heat sink that can dissipate huge amounts of heat, allowing it to be used in a variety of applications where a high level of cooling is needed.

Conclusion

The ATS-02D-27-C2-R0 Fins Heat Sink is an excellent choice for applications that require good cooling in tight spaces. Its slim body combined with its increased surface area and high thermal resistance make it a great option for electronic devices that generate a lot of heat. Its powder-coated aluminium body and zinc-plated steel mounting brackets ensure secure and efficient heat dissipation, making it perfect for a variety of applications.

The specific data is subject to PDF, and the above content is for reference

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