| Allicdata Part #: | ATS-03D-02-C3-R0-ND |
| Manufacturer Part#: |
ATS-03D-02-C3-R0 |
| Price: | $ 3.60 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X12.7MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03D-02-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.26907 |
| 30 +: | $ 3.18087 |
| 50 +: | $ 3.00422 |
| 100 +: | $ 2.82744 |
| 250 +: | $ 2.65074 |
| 500 +: | $ 2.56237 |
| 1000 +: | $ 2.29730 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.44°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks
The thermal management of electronic devices involves a process of transferring heat away from the device by the use of thermal conductive materials and materials that facilitate the dissipation of thermal energy into the surrounding environment. This is where the ATS-03D-02-C3-R0 Heat Sinks come into play. Heat sinks provide thermal protection from the buildup of heat within an enclosure or device, while allowing a smooth flow of air throughout the device to maintain optimal functioning. ATS-03D-02-C3-R0 Heat Sinks provide efficient cooling to protect valuable electronics.
Application Field
ATS-03D-02-C3-R0 Heat Sinks find their application anywhere where the efficient cooling of electronic components is required. Common areas of application include computers, electronic appliances, military hardware, telecommunications, medical equipment, automotive components and other high-efficiency applications. These heat sinks offer both lightweight and durable designs which help dissipate heat quickly to maintain a stable operating temperature.
Working Principle
The ATS-03D-02-C3-R0 Heat Sinks are designed to efficiently dissipate heat generated by electronics devices. The working principle of these heat sink designs is based on several concepts of heat transfer. Firstly, heat is conducted away from the component to the enclosure or device. Secondly, the heat is convected away from the device by using air flow to move the hot air away from the device surface. Finally, radiation is used to dissipate the stored heat into the atmosphere.
The heat sinks are constructed using a combination of aluminum, copper and steel which provide the greatest efficiency of thermal transfer in the most compact form. The design of the heat sink incorporates a large contact surface area which allows heat to spread across the entire sink. In addition, this design also ensures that the air flow that is expelled from the heatsink is evenly spread across the device. This helps to reduce hotspots from developing and improves overall thermal performance.
Conclusion
The ATS-03D-02-C3-R0 Heat Sinks provide efficient cooling for high-performance electronics. These heat sinks work by allowing air to circulate over the heat source which transfers heat away from the device. The design of the heat sink also helps to spread the heat over a larger surface area to provide greater efficiency. Heat sinks are an essential component in the thermal management of electronic components and the ATS-03D-02-C3-R0 Heat Sinks provide a reliable and efficient cooling solution.
The specific data is subject to PDF, and the above content is for reference