| Allicdata Part #: | ATS-03E-10-C3-R0-ND |
| Manufacturer Part#: |
ATS-03E-10-C3-R0 |
| Price: | $ 3.93 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03E-10-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.57399 |
| 30 +: | $ 3.37554 |
| 50 +: | $ 3.17696 |
| 100 +: | $ 2.97845 |
| 250 +: | $ 2.77989 |
| 500 +: | $ 2.58133 |
| 1000 +: | $ 2.53168 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.99°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are mechanical structures designed to transfer heat away from a heat source, such as a circuit board, CPU, or other electronic components. A typical heat sink consists of a base made of a highly heat-conductive material such as aluminum, copper, or graphite, along with fins extending from the base to increase the thermal transfer area. Heat is removed from the heat source by conduction or convection, which is then dissipated by the fins. The ATS-03E-10-C3-R0 is a high-performance heat sink designed to dissipate heat quickly and efficiently.
The ATS-03E-10-C3-R0 features an optimized fin design, with an optimized pitch angle and optimized fin length. The fin design allows for maximum surface area and increased air circulation, resulting in higher thermal dissipation. The base of the heat sink is made of high-grade aluminum alloy, which offers excellent thermal conductivity. In addition, the base is precision machined to ensure maximum contact with the heat source, and to ensure the heat sink securely fits into place.
The ATS-03E-10-C3-R0 has a wide range of applications and can be used in a variety of electronic devices. It can be used to dissipate heat in CPUs, DSPs, GPUs, ASICs, and other integrated circuits. The heat sink is also suitable for use in communication systems, computers, data center systems, industrial control systems, automotive electronics, and military applications.
The ATS-03E-10-C3-R0 works by transferring heat from the heat source into the fin structure. Heat is conducted from the heat source through the base of the heat sink and then dissipated into the fins. As air travels through the fins, it circulates and cools the fins, thereby allowing heat to be dissipated into the ambient atmosphere. This process ensures that the heat source remains within an acceptable temperature range and prevents it from overheating and damaging other components.
The ATS-03E-10-C3-R0 is an effective heat dissipation solution for a number of applications. It offers efficient thermal dissipation while still protecting the heat source from overheating. The heat sink is available in a variety of configurations, making it suitable for use in a variety of applications.
The specific data is subject to PDF, and the above content is for reference