ATS-04B-05-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-04B-05-C1-R0-ND

Manufacturer Part#:

ATS-04B-05-C1-R0

Price: $ 3.45
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X25MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-04B-05-C1-R0 datasheetATS-04B-05-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.13866
30 +: $ 3.05361
50 +: $ 2.88401
100 +: $ 2.71435
250 +: $ 2.54470
500 +: $ 2.45987
1000 +: $ 2.20541
Stock 1000Can Ship Immediately
$ 3.45
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 8.69°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management systems play an essential role in the operation of many electronics devices. As these devices become more complex, so too does the requirement for efficient thermal solutions. The ATS-04B-05-C1-R0 heat sink is one of the latest developments in the area of thermal management. Its high efficiency, wide range of application, and low power consumption make it a preferred choice for many different applications.

The ATS-04B-05-C1-R0 is a fanless, open-air heat sink designed to manage and spread the heat generated by electronic components. It utilizes a combination of aluminum fins and an integrated thermal conductive plate which maximizes heat dissipation. Additionally, its flat-panel design ensures a low-profile profile and allows for installation in tight spaces and limited-clearance locations. The lightweight construction and modular design make it easier to install, reducing downtime and maximizing system performance.

The primary application area for the ATS-04B-05-C1-R0 is in data centers and other areas where large amounts of heat must be efficiently managed. It is designed to handle the high capacity of heat generated by CPUs, GPUs, and other components in a networking environment. Additionally, it can handle up to a two watt rating of energy, making it an ideal choice for demanding applications. Additionally, its noiseless operation and quiet fan-less design make it suitable for use in noise-sensitive environments.

The working principle behind the ATS-04B-05-C1-R0 is simple. Heat is transferred from the component to the fins and then radiated out. Heat transfer is further increased by the thermal conductive plate, which helps to maximize the amount of heat that is dissipated. Additionally, its advanced cooling technology ensures that heat is efficiently managed, increasing the reliability and lifespan of the components.

In conclusion, the ATS-04B-05-C1-R0 is a great choice for any application that requires efficient and reliable thermal management. Its lightweight construction and advanced cooling technologies make it an ideal choice for data centers and other applications where heat must be managed and dissipated. With its noiseless operation and wide range of applications, this fanless heat sink is a great choice for many modern electronics.

The specific data is subject to PDF, and the above content is for reference

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