ATS-04F-74-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-04F-74-C1-R0-ND

Manufacturer Part#:

ATS-04F-74-C1-R0

Price: $ 3.17
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 25X25X15MM R-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-04F-74-C1-R0 datasheetATS-04F-74-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 2.87721
30 +: $ 2.79909
50 +: $ 2.64361
100 +: $ 2.48812
250 +: $ 2.33264
500 +: $ 2.25488
1000 +: $ 2.02162
Stock 1000Can Ship Immediately
$ 3.17
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 0.984" (25.00mm)
Width: 0.984" (25.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.590" (15.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 20.28°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Thermal solutions such as heat sinks are often deployed as a method of cooling off electronics or other electronics components that generate high amounts of heat. The ATS-04F-74-C1-R0thermal-heat sink is one of the most popular options, and is highly lauded for its size and performance. Here, we\'ll explore its application fields and working principles so we can better understand its functions and capabilities.

How ATS-04F-74-C1-R0 Heat Sink Operates

The thermal-cooling efficiency of the ATS-04F-74-C1-R0 heat sink is achieved through its use of finned-sleeves, which diverts heat away from the component or components it is cooling. The base of the unit is designed to mount onto the component, and the fins are soldered into place along the edges. The finned-sleeves act an excellent medium for transferring heat from the component to the surrounding air. In this way, heat energy is dissipated while still keeping the components within acceptable temperatures.

Another key element of the ATS-04F-74-C1-R0 design is their efficient use of air cooling. As hot air is diverted away, cooler air is drawn in around the heat sink. This acts like a sealed environment, allowing the heat to be effectively drawn away until the component reaches its optimal temperature. The efficiency of this cooling process is further enhanced by the use of internal baffles and vents, which ensure that the heat is evenly distributed and dissipates uniformly.

Application of ATS-04F-74-C1-R0 Heat Sink

The ATS-04F-74-C1-R0 heat sink is often used in applications where a large amount of heat needs to be dissipated in a small area or volume. As a result, it is especially well-suited for cooling chipsets, CPUs, LED lighting and other electronics that need intensive cooling but are sensitive to size and weight. It is also frequently deployed in live-on-stage lighting fixtures due to its heat-resistant and durable design.

The ATS-04F-74-C1-R0 is also widely used in the automotive industry. Due to its slim design, it is able to fit easily inside even the most confined engine bays. ATS-04F-74-C1-R0 can help ensure that auto engines don’t overheat at high speeds or when under stress. The heat sink is also used in home appliances for efficient cooling, as well as in industrial automation applications where precise performance is essential.

Features of ATS-04F-74-C1-R0 Heat Sink

The ATS-04F-74-C1-R0 heat sink features several advantages that make it a preferred choice for many applications. Its light-weight construction makes it easy to install while its large surface area affects heat dissipation. The thermal-heat sink also features a simple yet reliable design that ensures an even heat distribution and ensures the longevity of the component. Additionally, it comes in a variety of sizes and shapes to suit various applications.

The ATS-04F-74-C1-R0 heat sink is also noted for its durability and superior performance. Its finned-sleeves are made from robust and corrosion-resistant materials that are able to withstand operating temperatures of up to +85°C. The unit’s fan guards also protect its fins from any dust or debris, further extending its lifespan. Finally, its copper alloy construction helps reduce the occurrence of failure due to temperature oscillations.

Conclusion

The ATS-04F-74-C1-R0 thermal-heat sink is a multi-purpose device ideally suited for cooling sensitive electronics and components. It features a lightweight, easily-installed design with a large surface area for efficient heat dissipation. Its use of finned-sleeves allows for maximum heat transfer and a sealed environment for air cooling. Furthermore, its durable construction and reliable design ensure that this heat sink can handle whatever applications it might encounter.

The specific data is subject to PDF, and the above content is for reference

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