ATS-05C-09-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.790" (20.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	10.56°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction of Thermal - Heat Sinks

Thermal Heat Sinks refer to the device which transfers heat away from an object, such as an electronic component, and dissipates it into the cooler ambient environment. Mainly composed of a fan, heat sink and other materials, heat sinks are used to cool electronic systems, which would otherwise overheat and damage the system. Thermal Heat Sinks are classified according to their working principle.

ATS-05C-09-C1-R0 application field and working principle

The ATS-05C-09-C1-R0 is a Thermal Heat Sink developed by the American Thermal Imaging company. It is specially designed for cooling VGA (Video Graphics Array) and other high power electronic components in compact designs and harsh environments. This thermal heat sink offers excellent cooling capacity with finpat thermal transport and low thermal resistance, even though its dimensions are quite small. The ATS-05C-09-C1-R0 is mainly designed to provide efficient and uniform thermal dissipation for a wide range of components.The ATS-05C-09-C1-R0 utilizes the natural convective air-cooled cooling method, in which the cooling air is drawn in by the fan and used to keep the components at a stable temperature. Through its ingenious fin-pat constructed aluminum base plate and copper heat pipes, the ATS-05C-09-C1-R0 is able to quickly dissipate the heat away from the components, and letting it spread into the environment. The utilization of the heat sink also helps reduce the temperature of the surrounding components, allowing them to run more efficiently.

Conclusion

The ATS-05C-09-C1-R0 Thermal Heat Sink from American Thermal Imaging is a reliable device to cool down the overheating VGA and other high power electronic components. By utilizing the natural convective air-cooled cooling method, this thermal heat sink can quickly dissipate the heat into the environment while keeping the components at a stable temperature. The ATS-05C-09-C1-R0 is a great product for those looking for efficient and uniform thermal dissipation.

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