| Allicdata Part #: | ATS-05F-32-C2-R0-ND |
| Manufacturer Part#: |
ATS-05F-32-C2-R0 |
| Price: | $ 5.81 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 57.9X36.83X11.43MM T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: | ATS-05F-32-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.22837 |
| 30 +: | $ 4.93773 |
| 50 +: | $ 4.64726 |
| 100 +: | $ 4.35683 |
| 250 +: | $ 4.06637 |
| 500 +: | $ 3.77592 |
| 1000 +: | $ 3.70330 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.280" (57.90mm) |
| Width: | 1.450" (36.83mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.450" (11.43mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 21.46°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-05F-32-C2-R0 Thermal-Heat Sink is a device used to manage and dissipate heat generated by electrical components. It is commonly used in applications such as automotive electronics, industrial electronics, medical equipment, and consumer products. For these applications, it is important to be able to regulate and dissipate the generated heat, preventing the components from overheating and causing damage.
The ATS-05F-32-C2-R0 Thermal-Heat Sink consists of two main parts, an outer aluminum housing and an inner copper base. The outer aluminum housing acts as a heat shield to block out as much of the surrounding air as possible. This prevents the area from becoming too hot and causing the components inside to overheat. The inner copper base acts as a heat sink, transferring the generated heat to the surrounding air. To further increase the efficiency of the heat transfer, the entire surface of the base is perforated with small holes or fins. This increases the exposed surface area, allowing more heat to be absorbed and dissipated.
The working principle of the ATS-05F-32-C2-R0 Thermal-Heat Sink is based on the difference in thermal conductivity between the aluminum housing and the copper base. The aluminum housing has a lower thermal conductivity than the copper base, meaning that the heat generated by the components will enter the aluminum housing first. The inner copper base then absorbs the generated heat and dissipates it to the surrounding air. This ensures that the components inside the housing remain cool and operate correctly.
There are several advantages to using the ATS-05F-32-C2-R0 Thermal-Heat Sink for applications such as automotive electronics, industrial electronics, medical equipment and consumer products. Firstly, the aluminum housing provides an effective barrier against the surrounding air, preventing overheating of the components. Secondly, the copper base is highly effective in dissipating the generated heat. Lastly, the perforated fins on the base increase the exposed surface area, further increasing the efficiency of the heat transfer.
Overall, the ATS-05F-32-C2-R0 Thermal-Heat Sink is an effective heat management and dissipation solution for applications such as automotive electronics, industrial electronics, medical equipment and consumer products. It is a reliable and cost effective solution for controlling the temperature in these areas.
The specific data is subject to PDF, and the above content is for reference
ATS-05F-32-C2-R0 Datasheet/PDF