| Allicdata Part #: | ATS-05G-196-C3-R0-ND |
| Manufacturer Part#: |
ATS-05G-196-C3-R0 |
| Price: | $ 3.47 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X6MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-05G-196-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.15063 |
| 30 +: | $ 3.06516 |
| 50 +: | $ 2.89498 |
| 100 +: | $ 2.72462 |
| 250 +: | $ 2.55435 |
| 500 +: | $ 2.46919 |
| 1000 +: | $ 2.21376 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.236" (6.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.26°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-05G-196-C3-R0 Thermal - Heat Sink is an aluminum-based component designed to provide a convenient and reliable source of thermal solutions for a variety of applications, including industrial, medical, consumer, and military. The ATS-05G-196-C3-R0 heat sink has a highly efficient cooling capability and can efficiently dissipate heat generated from higher power components. It offers superior thermal performance and extremely low thermal resistance.
The ATS-05G-196-C3-R0 heat sink has a rugged construction and is designed for long-term use. Its robust construction allows for efficient dissipation of heat from power components, while its high thermal conductivity ensures excellent temperature control. The ATS-05G-196-C3-R0 thermal - heatsink can be used in a wide temperature range, from -20°C to 85°C, and is available in various sizes and configurations.
The ATS-05G-196-C3-R0 thermal - heat sink works by transferring heat away from the device that needs to be cooled. The thermal resistance of the sink is lower than other alternatives, so the heat can be quickly spread over the surface of the sink. Heat generated from the device is conducted through the walls of the sink and dissipated into the surrounding environment.
In a typical application, such as a high power computer processor, the heat generated is channeled into the ATS-05G-196-C3-R0 thermal - heat sink. From there, the sink dissipates the heat into its surrounding environment. The dissipated heat can be further directed away from the processor through mechanical means, such as fans and blowers.
The ATS-05G-196-C3-R0 thermal - heat sink also has an effective design, with features that include multiple fins for enhanced heat dissipation and uniform cooling. The fins are arranged in close proximity to heat-generating devices to provide an efficient thermal path. In addition, the fins are designed to increase air circulation, which helps reduce thermal resistance and spread the heat away from the heat sink.
The ATS-05G-196-C3-R0 thermal - heat sink is also designed with a special heat-spreading feature. This feature allows the sink to spread heat uniformly and reduce hot spots. By decreasing hot spots, the heatsink is able to maintain more consistent temperatures, making it ideal for applications that require reliable thermal performance.
In addition to serving as a cooling device, the ATS-05G-196-C3-R0 thermal - heat sink can be used in a wide range of applications. It is used for a variety of industries and products, such as metal enclosure protects, RF amplifiers, power supplies, LEDs, motor controllers, microprocessors, and biomedical instruments. By providing a reliable source of thermal solutions for these various applications, the ATS-05G-196-C3-R0 Thermal - Heat Sink helps companies to maximize the performance and efficiency of their devices.
The specific data is subject to PDF, and the above content is for reference