| Allicdata Part #: | ATS-06C-176-C1-R0-ND |
| Manufacturer Part#: |
ATS-06C-176-C1-R0 |
| Price: | $ 3.45 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X15MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-06C-176-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.13866 |
| 30 +: | $ 3.05361 |
| 50 +: | $ 2.88401 |
| 100 +: | $ 2.71435 |
| 250 +: | $ 2.54470 |
| 500 +: | $ 2.45987 |
| 1000 +: | $ 2.20541 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.56°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management has long been an important factor in ensuring the efficiency and reliability of electronic components. As the demand for high performance and long service life increases, so does the need for effective cooling solutions. ATS-06C-176-C1-R0 is a high performance heat sink designed to dissipate heat from high power components and maintain optimal temperatures in a wide range of applications.
The ATS-06C-176-C1-R0 is a thermal - heat sink solution that provides a cost-effective solution for cooling electronic components. It is comprised of a heat sink base, thermoelectric legs, and a cooling fan. The base of the heat sink is made of aluminum and is designed to provide a solid platform for the thermoelectric legs and cooling fan. The thermoelectric legs are made of a thermally conductive material and are responsible for transferring the heat generated by the components to the base of the heat sink. The cooling fan is then used to dissipate the heat from the sink and away from the electronic components.
ATF-06C-176-C1-R0 is a versatile temperature management solution that can be used in a variety of applications. It is typically used in industrial and domestic environments such as telecommunications, medical, automotive, IT, and consumer electronics. It is also ideal for medium to high power components such as CPUs, GPUs, HDDs, SSDs, and other high-end components. In addition, the ATS-06C-176-C1-R0 can also be used in outdoor applications such as temperature monitoring systems and power plants.
The ATS-06C-176-C1-R0 is designed to operate in a wide range of temperatures, from -20°C to +120°C. This range of temperatures is ideal for dissipating the heat generated by high-power components, allowing them to maintain optimal temperatures for long periods of time. The heat sink also offers a high heat transfer efficiency (HFE) of 70%. This enables the ATS-06C-176-C1-R0 to effectively dissipate heat from the components by quickly bringing them to optimal temperatures.
In addition, the ATS-06C-176-C1-R0 is highly reliable and durable, with an overall lifetime rating of up to 50,000 hours. This makes it a great choice for applications that need to operate for long periods of time without interruption. The heat sink is also designed for easy installation and maintenance, as no additional hardware or tools are required.
Overall, the ATS-06C-176-C1-R0 is a high performance thermal - heat sink solution that is designed to effectively dissipate heat from high power components. It is reliable, durable, and can be easily installed. It is the perfect choice for applications that need effective cooling solutions to maintain optimal temperatures for long periods of time.The specific data is subject to PDF, and the above content is for reference