ATS-06G-46-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	0.984" (25.00mm)
Width:	0.984" (25.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	11.84°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

A thermal power management device, commonly referred to as a heat sink, is an assembly designed to dissipate residual heat from an electronic or mechanical device. Heat sinks use a combination of conductive and convective heat transfer to dissipate large amounts of energy, allowing the device to remain within a desirable temperature range. The ATS-06G-46-C3-R0 heat sink is a high performance solution optimized for ultra-high current electronic systems. Additionally, its extended surface area and advanced construction provides excellent thermal properties and durability to allow it to perform in a wide range of applications. In this article, we will discuss the application field and working principle of the ATS-06G-46-C3-R0 heat sink.

Application Field

The ATS-06G-46-C3-R0 heat sink is a maintenance-free thermal solution suitable for use in a variety of power management applications, such as automotive, consumer electronics, industrial, medical, and aerospace applications. In these application areas, the extended surface area and advanced construction of the ATS-06G-46-C3-R0 heat sink make it ideally suited for high heat dissipation requirements.On the automotive side, the ATS-06G-46-C3-R0 heat sink is an excellent choice for engine control modules (ECMs), powertrain control modules (PCMs), and batteries. Its superior thermal properties make it the preferred cooling solution for ECMs, PCMs, and batteries located in tight or confined spaces, such as under the hood.The ATS-06G-46-C3-R0 also offers exceptional thermal performance in consumer electronics applications. It is ideal for cooling CPUs, FPGAs, GPUs, SOCs, and memory controllers. Its unique construction and extended surface area make it an superior solution for cooling these components in modern electronic devices.The ATS-06G-46-C3-R0 heat sink is also an excellent choice for medical and industrial applications. In medical applications, it is an ideal cooling solution for implants, such as pacemakers and implantable cardioverter defibrillators. In industrial applications, the ATS-06G-46-C3-R0 is well suited for power supply and motor control applications, as well as various other machine control functions, such as robot controllers and automated testing equipment.

Working Principle

The ATS-06G-46-C3-R0 heat sink utilizes both conductive and convective thermal energy transfer to dissipate excess energy from the heat-generating component. Its extended surface area and advanced construction provide superior thermal properties to ensure optimal cooling performance.The heat sink is constructed of copper or aluminum alloy with a series of fins arranged in an efficient pattern. The fins are designed to increase the surface area of the heat sink, allowing for more heat transfer. The fins are spaced apart to facilitate convection cooling, as heated air rises away from the heat generating component. The fins are also designed to allow for the maximum amount of air flow, allowing for heat dissipation.Additionally, the heat sink also features a base plate with a thermal interface material, which helps to improve conduction heat transfer. The base plate helps to transfer the heat generated by the component to the heat sink, allowing for more efficient cooling.

Conclusion

The ATS-06G-46-C3-R0 heat sink is a high performance thermal solution suitable for automotive, consumer electronics, industrial, medical, and aerospace applications. Its extended surface area and advanced construction provide superior thermal properties and durability, making it ideal for cooling high heat dissipation components. The heat sink utilizes both conductive and convective heat transfer to dissipate the energy from the component, resulting in improved system performance and reliability.

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