| Allicdata Part #: | ATS-06H-163-C3-R0-ND |
| Manufacturer Part#: |
ATS-06H-163-C3-R0 |
| Price: | $ 4.61 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X30MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-06H-163-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.15233 |
| 30 +: | $ 3.92175 |
| 50 +: | $ 3.69104 |
| 100 +: | $ 3.46040 |
| 250 +: | $ 3.22971 |
| 500 +: | $ 2.99902 |
| 1000 +: | $ 2.94134 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 2.99°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Introduction
ATS-06H-163-C3-R0 is a type of thermal heat sink, used in a variety of applications where thermal management of components is essential. Heat sinks play a key role in the thermal management of components as they provide a physical barrier between the component and the ambient environment, that protects the component from overheating. The ATS-06H-163-C3-R0 heat sink features an aluminum heat sink with a copper vapor chamber, making it suitable for a range of temperature control and energy efficiency applications. This article looks at the application field and working principle of the ATS-06H-163-C3-R0 heat sink.
Application Field
The ATS-06H-163-C3-R0 heat sink is designed for a range of thermal applications. It can be used in computers, medical equipment, and industrial equipment, including but not limited to: data centers, x-ray processing, telecommunications equipment, and other high-temperature electronics. In these application areas, the heat sink typically provides the temperature control necessary for efficient operation. Additionally, the copper vapor chamber improves the thermal efficiency of the heat sink by drawing heat away from the component.
The ATS-06H-163-C3-R0 heat sink is also used in LED applications. LEDs are prone to heat generation, which can impact their performance and longevity. The ATS-06H-163-C3-R0 heat sink helps to dissipate this heat, allowing LEDs to maintain their bright light output. The heat sink is often used in LED strip projects, providing a cost-efficient and reliable cooling solution.
The ATS-06H-163-C3-R0 heat sink is also ideal for solar and photovoltaic applications. Thermal management is a key factor in the efficient operation of solar cells and photovoltaic cells, and the ATS-06H-163-C3-R0 provides the necessary temperature control. The copper vapor chamber helps to dissipate generated heat, allowing the components to function at their optimal level.
Working Principle
The ATS-06H-163-C3-R0 heat sink works on a very simple principle. As heat is generated from electrical components, it dissipates into the environment. The heat sink is designed to absorb this heat, and then dissipates it away from the component. It does this using a combination of an aluminum heat sink and a copper vapor chamber.
The aluminum heat sink is designed to absorb the heat from the component. Its high thermal conductivity allows it to quickly and effectively take the heat away from the component. The copper vapor chamber dissipates the heat away from the component, allowing the component to stay cool. The copper chamber also acts as a barrier between the component and the environment, reducing the potential for thermal stress.
The ATS-06H-163-C3-R0 heat sink is a highly efficient and reliable thermal solution. It is designed to provide the necessary thermal control and efficiency for a range of applications, including computer, medical, and industrial equipment, and LED strips and solar/photovoltaic solutions. The combination of aluminum and copper ensures that the component stays cool, and the copper vapor chamber acts as a barrier between the component and the environment, reducing the potential for thermal stress.
In conclusion, the ATS-06H-163-C3-R0 heat sink is a highly reliable and effective thermal solution for a range of applications. It features an aluminum heat sink and a copper vapor chamber, providing the necessary temperature control and energy efficiency. The ATS-06H-163-C3-R0 is suitable for a variety of applications, including computer, medical, and industrial equipment, and LED and solar/photovoltaic solutions.
The specific data is subject to PDF, and the above content is for reference