ATS-07C-120-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	3.45°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal - Heat Sinks

Thermal heat sinks are some of the most common and versatile components in electronics. They are usually made of aluminium or copper and are used to transfer thermal energy away from a device, typically by convection. They help keep temperatures in devices within normal operating ranges, preventing overheating and maximizing performance. The ATS-07C-120-C1-R0 heat sink is a common choice for many electronic designs. It is a standard heat sink designed to meet UL 94V-0 flammability standards, which means it is suitable for use in enclosed devices. The ATS-07C-120-C1-R0 measures 120mm long, 80mm wide, and 25mm high, making it an ideal size for many applications.This heat sink is made of aluminium and is suited to a wide range of temperatures. It has a minimum thermal resistance of 0.091 °C/W, making it an efficient heat dissipation solution.The ATS-07C-120-C1-R0 can be used in both active and passive thermal management solutions. For active solutions, the fan can be mounted directly on top of the heat sink, or a duct can be used to direct the air across the surface. In passive solutions, the heat sink can be mounted on the CPU directly, or a combination of heat pipes or phase change materials could be used. In active solutions, the fan is generally wired directly into the power supply and runs continuously, or it is controlled by a thermal switch. The fan pulls air from the environment and pushes it across the surface of the heat sink. The fan also helps pull hot air away from the device, ensuring better cooling.In passive solutions, the heat sink is mounted directly onto the CPU or other heat-generating components. The heat is transferred by conduction from the component to the heat sink, cooling the device. Heat pipes or phase change materials can be added to the heat sink to increase effectiveness.The main advantage of the ATS-07C-120-C1-R0 is its size and versatility. It can be used in a variety of applications, from PCs and servers to small embedded systems. Its low thermal resistance makes it an efficient heat sink, and its small size makes it easy to mount in tight spaces. Overall, the ATS-07C-120-C1-R0 is an effective and versatile heat sink solution for a wide range of applications. It is well-suited to both active and passive thermal management solutions, and its small size makes it easy to mount in tight spaces. Its low thermal resistance ensures effective heat dissipation, making it an ideal choice for many electronic designs.

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