| Allicdata Part #: | ATS-07C-16-C1-R0-ND |
| Manufacturer Part#: |
ATS-07C-16-C1-R0 |
| Price: | $ 3.56 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-07C-16-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.23379 |
| 30 +: | $ 3.14622 |
| 50 +: | $ 2.97133 |
| 100 +: | $ 2.79657 |
| 250 +: | $ 2.62181 |
| 500 +: | $ 2.53441 |
| 1000 +: | $ 2.27223 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.06°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-07C-16-C1-R0 is a thermally efficient device designed to conduct heat away from heat generating components such as processors, transistors, and touchscreens, and is used in a variety of applications. The ATS-07C-16-C1-R0 thermal conduction system is one of the most commonly used thermal-heat sinks in the market and is available in different versions and sizes.
Thermal Convection
The ATS-07C-16-C1-R0 thermal conduction system uses a combination of natural or forced convection to transfer heat from heat generating components to the ambient environment. Natural convection is when hot air rises and cool air falls. This causes the air to mix, which helps dissipate the heat. Forced convection is when airflow is driven by fans or other forms of aerodynamics, such as fans or air pumps, which forces air to mix.
Thermal Dispersal
The ATS-07C-16-C1-R0 thermal conduction system also employs thermal dispersal to transfer heat from heat generating components to the environment. Thermal dispersal is a method of distributing heat away from hot spots using conduction, convection, or radiation. As the temperature rises, heat is dispersed away from the hot spots to provide a more uniform temperature distribution throughout the system.
Thermal Expansion & Contraction
The ATS-07C-16-C1-R0 thermal conduction system also includes thermal expansion and contraction. Thermal expansion is when heat causes a material to expand, while thermal contraction is when heat causes a material to contract. The ATS-07C-16-C1-R0 system uses a combination of thermal expansion and contraction to transfer heat away from hot spots. As the temperature of the system increases, the material will expand, causing the heat to disperse faster and more evenly.
Thermal Insulation
The ATS-07C-16-C1-R0 thermal conduction system includes thermal insulation, which helps prevent the escape of heat. Thermal insulation helps contain the heat, allowing it to transfer through the system at a slower rate. This slower transfer rate helps prevent the surrounding components from overheating.
High Performance Materials
The ATS-07C-16-C1-R0 thermal conduction system uses high performance materials, which help transfer heat faster and more efficiently than other materials. These materials include aluminum, copper, and other metals, which all have thermal conductivity properties that help transfer heat away from the heat-generating components.
Conclusion
The ATS-07C-16-C1-R0 thermal conduction system is a thermally efficient device designed to conduct heat away from heat-generating components. The system uses a combination of natural and forced convection to transfer heat away from hot spots, and thermal dispersal and insulation to help contain the heat. The system also uses high performance materials that increase the rate of heat transfer. The ATS-07C-16-C1-R0 thermal conduction system is one of the most commonly used thermal-heat sinks in the market and is available in different versions and size.
The specific data is subject to PDF, and the above content is for reference