| Allicdata Part #: | ATS-07C-20-C1-R0-ND |
| Manufacturer Part#: |
ATS-07C-20-C1-R0 |
| Price: | $ 3.99 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-07C-20-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.62061 |
| 30 +: | $ 3.41922 |
| 50 +: | $ 3.21817 |
| 100 +: | $ 3.01701 |
| 250 +: | $ 2.81588 |
| 500 +: | $ 2.61474 |
| 1000 +: | $ 2.56446 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.13°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-07C-20-C1-R0 thermal - heat sink is a highly efficient cooling product designed for a variety of applications. This product is specifically designed to provide superior thermal management, allowing for a wide range of cooling applications for a variety of electronic components. The ATS-07C-20-C1-R0 is made with a unique heat dissipating design that allows it to be highly effective in reducing heat generated by electronic components. This makes it an ideal cooling product for a variety of applications.
The ATS-07C-20-C1-R0 is composed of a base layer, followed by a thermal dissipating layer and finally a top layer. The base layer is composed of a highly conductive material, such as copper or aluminum, which is used to help transfer heat away from a component. The thermal dissipating layer is composed of a material that has high thermal conductivity and is able to effectively disperse the heat away from the component. Finally, the top layer is composed of a conductive material which helps to spread the heat evenly throughout the product.
The ATS-07C-20-C1-R0 is typically used in applications where a wide range of temperatures is necessary. It can be used to cool electronic devices such as CPUs, GPUs, hard drives, memory chips, and other heat generating components. It is also often used to cool larger components, such as servers. This thermal solution has been found to be extremely effective in controlling temperatures in a variety of applications, due to its efficiency in efficiently dissipating heat. Its top layer helps to evenly spread the heat away from the components in an efficient manner.
The ATS-07C-20-C1-R0 also has a unique working principle that helps it to effectively dissipate heat away from components. This principle is based on the transfer of heat between the two different layers of the product. Heat is absorbed by the base layer and then is transferred to the thermal dissipating layer. The thermal dissipating layer then dissipates the heat away from the component. The top layer acts as a mechanism to evenly disperse the heat throughout the product.
The ATS-07C-20-C1-R0 is a highly efficient thermal product that is designed to provide superior thermal management and cooling applications. It works on the principle of heat transfer between the different layers, resulting in an efficient dissipating of heat away from components. Its unique design provides an optimal solution for cooling applications, making it ideal for a number of different applications. This product is ideal for a variety of electronic components, ranging from CPUs, GPUs, hard drives, memory chips, and other heat generating components.
The specific data is subject to PDF, and the above content is for reference