| Allicdata Part #: | ATS13262-ND |
| Manufacturer Part#: |
ATS-07F-207-C2-R0 |
| Price: | $ 5.17 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X12MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-07F-207-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.69350 |
| 10 +: | $ 4.56876 |
| 25 +: | $ 4.31500 |
| 50 +: | $ 4.06123 |
| 100 +: | $ 3.80740 |
| 250 +: | $ 3.55358 |
| 500 +: | $ 3.29975 |
| 1000 +: | $ 3.23630 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.472" (12.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.39°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is a critical component of any electronic system. Heat sinks are vital in keeping all electronic components functioning properly and avoiding overheating issues. The ATS-07F-207-C2-R0 is an aluminum extrusion heat sink designed to dissipate heat away from components in a cost effective manner. It does this by providing an effective means of heat transfer from components to an environment with lower thermal load.
The ATS-07F-207-C2-R0 has a fin profile design that maximizes surface area available for heat transfer. This design increases its effectiveness as compared to traditional flat or conical heat sinks. The fin profile also adds to its effectiveness by creating channels that direct air flow across the surface area of the fins. This air flow helps to better dissipate heat away from the components and into the environment.
The ATS-07F-207-C2-R0 also utilizes a fin material with excellent heat dissipation properties. The aluminum extrusion material is designed to transfer heat away from components quickly and efficiently. The material also has a high strength to weight ratio, which means that the ATS-07F-207-C2-R0 does not add much extra weight to the system.
The ATS-07F-207-C2-R0 can be used in a variety of applications. It is typically used in high-power applications such as high-powered processors, high-powered storage devices, and other components where quick heat dissipation is critical. It can also be used in applications where space is limited, as it allows for efficient heat transfer in compact spaces.
The ATS-07F-207-C2-R0 is easy to install and is available in a variety of sizes to suit any application. Its design also allows it to be mounted vertically or horizontally, giving users the flexibility to place the heat sink in the optimal position for efficient heat dissipation. The ATS-07F-207-C2-R0 is a reliable and efficient way to keep all components cool and functioning properly.
The specific data is subject to PDF, and the above content is for reference