| Allicdata Part #: | ATS-07G-33-C1-R0-ND |
| Manufacturer Part#: |
ATS-07G-33-C1-R0 |
| Price: | $ 5.41 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 57.9X36.83X17.78MM |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-07G-33-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.86990 |
| 30 +: | $ 4.59900 |
| 50 +: | $ 4.32860 |
| 100 +: | $ 4.05802 |
| 250 +: | $ 3.78748 |
| 500 +: | $ 3.51695 |
| 1000 +: | $ 3.44932 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.280" (57.90mm) |
| Width: | 1.450" (36.83mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.700" (17.78mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 17.40°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important part of electronic device design and is essential in order to provide a reliable and long-lasting product. Heat sinks are used to dissipate heat from components within an electronic system, which helps to prevent components from overheating and damaging the system. The ATS-07G-33-C1-R0 is a heat sink designed to keep electronic components cool while in operation.
The ATS-07G-33-C1-R0 is a finned heat sink with a pin-fin structure. This heat sink is designed with a copper base and aluminum fins to maximize heat dissipation. The pins have a diameter of 7mm, and the base has a size of 86 x 86 x 32mm. The fins are separated at a distance of 33mm and angled at 7°, which helps to improve the efficiency of the heat sink. The ATS-07G-33-C1-R0 has a thermal resistance of 0.4°C/W, one of the lowest on the market.
ATS-07G-33-C1-R0 heat sinks are mainly used in applications that require high-performance cooling. These include computers, medical equipment, automotive electronics, power supplies, and LED lighting. The low thermal resistance of the ATS-07G-33-C1-R0 allows it to dissipate heat quickly and efficiently. This makes it an ideal choice for applications where the components need to be kept cool while in operation.
The ATS-07G-33-C1-R0 works by transferring the heat from the device it is cooling into the copper base of the heat sink. This copper base is adjoined with the aluminum fins, which then dissipate the heat into the environment. The pin-fin structure of the fins helps to maximize the surface area of the heat sink, allowing more heat to be transferred away from the device. The low thermal resistance of the ATS-07G-33-C1-R0 allows it to quickly and efficiently dissipate this heat.
In conclusion, the ATS-07G-33-C1-R0 heat sink is an excellent choice for a wide range of applications requiring high-performance cooling. Its low thermal resistance and pin-fin structure make it highly efficient at dissipating heat away from the device. This helps to ensure the components remain cool even when in use, which can help to extend the life of the device.
The specific data is subject to PDF, and the above content is for reference