ATS-08B-123-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-08B-123-C1-R0-ND

Manufacturer Part#:

ATS-08B-123-C1-R0

Price: $ 3.40
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 50X50X20MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-08B-123-C1-R0 datasheetATS-08B-123-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.09078
30 +: $ 3.00741
50 +: $ 2.84029
100 +: $ 2.67322
250 +: $ 2.50614
500 +: $ 2.42260
1000 +: $ 2.17199
Stock 1000Can Ship Immediately
$ 3.4
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.969" (50.00mm)
Width: 1.969" (50.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.790" (20.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 4.14°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is a critical consideration for many electronics products. The ATS-08B-123-C1-R0 is a thermal solution specifically designed for high-power applications. Its unique combination of features makes it an ideal solution for temperature control and protection of thermal-sensitive devices.

The ATS-08B-123-C1-R0 is a heat sink designed to dissipate the heat generated by electrical components in a variety of commercial and industrial applications. The material used in the construction of the heat sink is aluminum, which has a high thermal conductivity. This ensures efficient heat dissipation, while also helping to keep the components cool during operation. The aluminum heat sink has a high surface area to volume ratio, which enables it to efficiently dissipate heat. The heat sink also features a thermal insulating layer and a fin design that further enhances its heat dissipation capabilities.

The ATS-08B-123-C1-R0 is designed to be used in applications where high-power devices generate significant amounts of heat. This could include high-end gaming systems or server systems, where the components are working constantly and require efficient cooling solutions. The heat sink also features a reversible airflow design, which allows it to be used in both horizontal and vertical configurations. The heat sink features clips and posts that enable it to be quickly and securely installed in a variety of applications.

The ATS-08B-123-C1-R0 operates by convection cooling. Heat generated by the components is dissipated to the surrounding environment via convective heat transfer. This allows for efficient cooling of the components, while also keeping the external environment cooler. Convection cooling is a proven and reliable method of cooling, and the ATS-08B-123-C1-R0 is designed to maximize the efficiency of convective heat transfer.

The ATS-08B-123-C1-R0 is designed to be reliable and durable. The aluminum construction ensures that the heat sink will not corrode or rust, which can lead to reduced performance and increased risk of failure. The heat sink also features a low profile, which is beneficial when installing in tight spaces.

The ATS-08B-123-C1-R0 is an excellent solution for cooling high-power devices in a wide variety of applications. Its high performance and reliability make it an ideal choice for those needing an effective cooling solution. With its efficient design and construction, the ATS-08B-123-C1-R0 is an excellent option for those looking for reliability and performance when cooling their electronic components.

The specific data is subject to PDF, and the above content is for reference

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