ATS-08C-120-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	3.57°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Application Fields and Working Principle of ATS-08C-120-C3-R0

Thermal Heat Sinks

Thermal heat sinks, also known as heat dissipaters, are devices used to dissipate heat from electronics or other components. They come in many shapes and sizes, and can be used for a variety of purposes. In this article, we’ll take a look at one specific type of heat sink – the ATS-08C-120-C3-R0 – and explore its application fields and working principle.The ATS-08C-120-C3-R0 is a thermal heat sink that is designed for use with electronic components in a wide range of temperatures. It is constructed from high-grade aluminum and is designed for efficient thermal loading and maximum cooling capabilities. The design also incorporates an anodized hard coat finish for superior corrosion resistance.The ATS-08C-120-C3-R0’s main application field is in cooling electronics in high temperatures. It is designed to dissipate heat away from components quickly and efficiently. It can be used in a diverse range of temperatures from -40 degrees Celsius to 120 degrees Celsius. Its maximum heat dissipation is 198W.The ATS-08C-120-C3-R0 also has a wide variety of mounting options. It can be installed with four screws, two rivets, or with standard mounting clips. This makes it very versatile and suitable for use in many different applications.In terms of working principle, the ATS-08C-120-C3-R0 operates via a thermally-conductive transfer. Heat is transferred from the electronics or components to the heat sink through contact. This is then dissipated away from the components by natural convection, which is the process of hot air being replaced by cooler air as the heat is transferred to the air surrounding the heat sink. This helps to keep the components at their optimal operating temperature.The ATS-08C-120-C3-R0 also comes with several features designed to improve thermal transfer efficiency. These include the incorporation of an optimized fin profile with two different fin heights, which helps to aid in the dissipation of heat away from the components quickly and efficiently. It also includes the use of high thermal-conductivity materials and advanced construction techniques to ensure maximum heat transfer performance.Overall, the ATS-08C-120-C3-R0 is an extremely versatile thermal heat sink that can help to keep electronics running optimally in extreme temperatures. It’s available in a variety of mounting options and comes with several features designed to aid in efficient heat transfer and cooling capabilities. With its high-grade aluminum construction and optimized fin profile, it is an excellent solution for a wide range of applications.

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