| Allicdata Part #: | ATS-08C-181-C1-R0-ND |
| Manufacturer Part#: |
ATS-08C-181-C1-R0 |
| Price: | $ 3.45 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X10MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08C-181-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.13866 |
| 30 +: | $ 3.05361 |
| 50 +: | $ 2.88401 |
| 100 +: | $ 2.71435 |
| 250 +: | $ 2.54470 |
| 500 +: | $ 2.45987 |
| 1000 +: | $ 2.20541 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.93°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-08C-181-C1-R0 is component parts in the Thermal – Heat Sinks family. The product is a heat sink, a device installed on a component such as a CPU or an IC Chip to dissipate heat away and to prevent overheating. The device is specifically designed to dissipate heat during transport to a target application. It is an efficient and durable device that is used in a variety of applications including power, RF 8& microelectronic.
The ATS-08C-181-C1-R0 is made from a high quality alloy and is able to manage heat with greater accuracy than most other heat sinks. The device is made from an alloy that is highly effective in transferring heat away from critical components. It is also compatible with a variety of different circuit boards and components. The device is designed to be compatible with both single-pad and dual-pad configurations. The device’s design includes a thermally conductive pedestal, an air gap, and a replaceable air gap.
The ATS-08C-181-C1-R0 is a great choice for applications requiring thermal management. It is suitable for a wide range of applications including power, RF 8& microelectronic, automotive, communications, industrial, medical, military, etc. The device is engineered for higher efficiency and higher reliability. In particular, the device is highly effective in managing temperature fluctuations in high-heat applications.
The ATS-08C-181-C1-R0\'s working principle is based on heat dissipation. It works by transferring heat from one part of the component to another part and then dispelling it away from the area. This process is called thermal conduction. It is a very efficient way of cooling down components. The device has several features that facilitate this process such as a heat spreader, heat dissipation fins, and mounting holes for attachment to other components.
The ATS-08C-181-C1-R0 is the perfect choice for applications that require a dependable and efficient thermal management solution. It offers a durable thermal solution that is highly effective in managing temperature fluctuations in high-heat applications. The device ensures that your devices remain cool even when placed in challenging environments. It is a great device for enhancing performance in a wide range of applications including power, RF 8& microelectronic, automotive, communications, industrial, medical, military, etc.
The specific data is subject to PDF, and the above content is for reference