ATS-08D-03-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-08D-03-C3-R0-ND

Manufacturer Part#:

ATS-08D-03-C3-R0

Price: $ 3.66
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X15MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-08D-03-C3-R0 datasheetATS-08D-03-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.32892
30 +: $ 3.23862
50 +: $ 3.05878
100 +: $ 2.87885
250 +: $ 2.69892
500 +: $ 2.60896
1000 +: $ 2.33906
Stock 1000Can Ship Immediately
$ 3.66
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.590" (15.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 15.97°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

There are many critical components in the electronics industry that must perform reliably at high temperatures and environments. This is where the ATS-08D-03-C3-R0 thermal - heat sinks come in. They are designed to dissipate heat away from electronics components and keep them from overheating.

The ATS-08D-03-C3-R0 thermal – heat sinks feature a patented block fin design with an anodized aluminum heatsink. This design offers superior thermal transfer and superior structural strength while preventing corrosion in harsh environments.

The ATS-08D-03-C3-R0 thermal – heat sinks are designed to be lightweight and cost-effective. They have a strong thermal conductance that is able to transfer heat away from electronic components and keep them running reliably. The design also offers excellent protection against corrosion in severe environments.

The ATS-08D-03-C3-R0 thermal – heat sinks can be used in a variety of applications, such as in consumer electronics, computer hardware, medical devices, and industrial equipment. They are also used in power supplies, engines, and any other application where thermal management is critical.

The ATS-08D-03-C3-R0 thermal – heat sinks are designed to provide optimal performance in a variety of environmental conditions. They feature a patented block fin design that is able to dissipate heat more quickly than a standard heat sink. This design also features an anodized aluminum heatsink that provides superior thermal transfer.

The ATS-08D-03-C3-R0 thermal – heat sinks also feature a unique fin construction that is designed to increase airflow and reduce noise. This design helps to keep components running at optimal temperatures, while providing a quieter operation.

The working principle of the ATS-08D-03-C3-R0 thermal – heat sinks is simple. The device is designed to absorb heat from electronic components and then transfer it away from them to the environment. The heat is then absorbed by the surrounding air, dissipated into the atmosphere, and dissipated into the environment.

To ensure the efficient transfer of heat away from components, the ATS-08D-03-C3-R0 thermal – heat sinks are designed with a large number of fins. These fins act as radiators, absorbing heat from the components and then transferring the heat to the surrounding air. This ensures that the components remain cool and running reliably.

The ATS-08D-03-C3-R0 thermal – heat sinks are designed to be easy to install and maintain. They feature an anodized aluminum heatsink that is easy to install and replace. In addition, these heat sinks can be easily adapted to different sized electronics components, giving them the flexibility to be used in a variety of applications.

The ATS-08D-03-C3-R0 thermal – heat sink makes it easy to keep electronics components running at optimal temperature. It is easy to install, simple to maintain, and offers superior thermal transfer and corrosion resistance. This makes it an excellent choice for any application where thermal management is critical.

The specific data is subject to PDF, and the above content is for reference

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