| Allicdata Part #: | ATS14368-ND |
| Manufacturer Part#: |
ATS-08D-132-C2-R0 |
| Price: | $ 5.74 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X25MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08D-132-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 5.21640 |
| 10 +: | $ 5.07780 |
| 25 +: | $ 4.79581 |
| 50 +: | $ 4.51357 |
| 100 +: | $ 4.23152 |
| 250 +: | $ 3.94942 |
| 500 +: | $ 3.66732 |
| 1000 +: | $ 3.59680 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 2.66°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat-sinks are generally used in thermal designs for their superior thermal conductivity and to dissipate heat from one area to another, such as from a hot spot on an electronic device to the ambient air. The ATS-08D-132-C2-R0 heat sink is a latest generation of heat sinks designed with advanced features to meet specific cooling applications that require superior levels of performance.
This ATS-08D-132-C2-R0 heat sink is a single-stage aluminum heat sink, which is designed with a high-performance and low thermal resistance to draw heat away from electronic components and cool them to guarantee a safe temperature operating range. It is particularly suitable for applications where a good mix of thermal performance, as well as cost, is desired. The aluminum construction helps to maintain the optimal thermal performance even under high temperatures and varying air flow directions.
The ATS-08D-132-C2-R0 promotes a wide range of airflows with their fin type design. The fins are made from high quality aluminum and are soldered to the base, creating a thermal conduction path that ensures thermal control. An upstream tempered glass laminate (TG) is added to the fins to maximize heat dissipation by providing increased fin surface area. The TG layer helps to retain heat, which is then transferred to the surrounding environment.
The ATS-08D-132-C2-R0 has a unique design that enables it to keep electronic components cool in a wide range of applications and conditions. It provides efficient cooling capabilities for a variety of components such as DC/DC converters, processors, graphics cards and microcontrollers. The ATS-08D-132-C2-R0 uses thermal-conductive material and features spring-loaded pins for pressure mounting, which helps to ensure a secure contact between the heat sink and device.
The ATS-08D-132-C2-R0 is designed for applications that require efficient cooling without excessive noise, vibration or other interference. It features a compact size, which makes it ideal for use in confined spaces, such as embedded systems and other devices. Its sleek design, coupled with its high thermal performance, makes it an excellent choice for use in a wide range of applications and settings.
Overall, the ATS-08D-132-C2-R0 heat sink is a reliable and cost effective cooling solution for a variety of applications. Its advanced design and superior thermal performance make it ideal for use in many industries, including automotive, medical, consumer electronics, industrial machinery, and many others. The ATS-08D-132-C2-R0 provides superior cooling performance while minimizing noise levels and vibration interference, making it ideal for cooling devices where the utmost precision and reliability are essential.
The specific data is subject to PDF, and the above content is for reference