| Allicdata Part #: | ATS-09A-16-C1-R0-ND |
| Manufacturer Part#: |
ATS-09A-16-C1-R0 |
| Price: | $ 3.56 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09A-16-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.23379 |
| 30 +: | $ 3.14622 |
| 50 +: | $ 2.97133 |
| 100 +: | $ 2.79657 |
| 250 +: | $ 2.62181 |
| 500 +: | $ 2.53441 |
| 1000 +: | $ 2.27223 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.06°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal & Heat Sinks are components that are used to dissipate thermally generated energy from electrical/electronic components. The aim of using such components is to protect those components from failure due to excessive heat. ATS-09A-16-C1-R0 is one such heat sinks which is widely used in many applications. This article looks into the application fields of the said component and its working principle.
The ATS-09A-16-C1-R0 is a thermal heat sink component designed to dissipate thermally generated energy from electrical/electronic components such as CPUs, transistors, IGBTs, and integrated circuits etc. It is made of aluminium and features a natural heat exchange structure that provides superior thermal performance. This structure optimizes the thermal transfer as heat passes through the fins, keeping the temperature regulated at optimal levels.
Due to its superior thermal performance, the ATS-09A-16-C1-R0 is ideal for a broad range of application fields. It is widely used in electrical/electronic components that generate a lot of heat, such as CPUs, IGBTs, and integrated circuits. It is also used in automotive applications, such as in the cooling systems of engines and electric systems, and in power supply systems for both consumer and industrial applications. In addition, it can also be applied to supercomputers, lighting/laser equipment, medical devices, military and aerospace equipment, and more.
The ATS-09A-16-C1-R0 works by transferring heat away from the device it is cooling. It is designed with an extrusion-type heat communication structure in which heat is absorbed by the fins and then the heat dissipates in air. The fins have a special structure that optimizes thermal transfer, thus helping to maintain optimal temperature levels. The component also features a natural heat exchange structure that ensures efficient thermal performance. In addition, it has a low profile design, making it easy to install in tighter spaces.
In conclusion, the ATS-09A-16-C1-R0 is a thermal heat sink component designed to dissipate thermally generated energy from electrical/electronic components. It has a natural heat exchange structure that ensures superior thermal performance and a low profile design that makes it suitable for a broad range of application fields. The component also works by transferring heat away from the device it is cooling, thus helping to maintain optimal temperature levels. With its superior thermal performance, the ATS-09A-16-C1-R0 can be utilized in many different applications for cooling in automotive, consumer, industrial, and military/aerospace settings.
The specific data is subject to PDF, and the above content is for reference