| Allicdata Part #: | ATS-09E-50-C1-R0-ND |
| Manufacturer Part#: |
ATS-09E-50-C1-R0 |
| Price: | $ 3.25 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09E-50-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.94840 |
| 30 +: | $ 2.86860 |
| 50 +: | $ 2.70925 |
| 100 +: | $ 2.54986 |
| 250 +: | $ 2.39047 |
| 500 +: | $ 2.31079 |
| 1000 +: | $ 2.07174 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.99°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important aspect of various applications in computing and electronics. The ATS-09E-50-C1-R0 is a type of heat sink designed to increase the performance and reliability of electronic products operating in high temperatures. It is a two-stage heat sink featuring an aluminum base plate and a thermally conductive copper fin stack. The combination of these two components increases the heat dissipation from the heat generating components and improves the overall performance of the system.
The ATS-09E-50-C1-R0 is made of aluminum with a specially thermally conductive coating applied to the base plate and fin stack. This ensures excellent heat transfer between the components and the heat sink. The aluminum base plate acts as a heat sink, absorbing the heat from the components. The copper fin stack dissipates the heat evenly and efficiently throughout the heat sink. This helps keep the temperature of the components lower, increasing their performance and reliability.
The ATS-09E-50-C1-R0 is ideal for applications that require high performance under high temperature conditions. It is lightweight and compact, making it a perfect choice for applications where weight and size may be an issue. The two-stage design of the ATS-09E-50-C1-R0 ensures improved heat dissipation compared to single-stage heat sinks. This makes it ideal for high-temperature applications or applications that require additional cooling capacity.
The ATS-09E-50-C1-R0 is easy to install due to its simple design. The base plate is designed with mounting holes for easy attachment to the chassis or other components. The copper fin stack fits around the base plate, ensuring an integrated and secure fit. The tightly packed fin stack allows for maximum heat dissipation with minimal air resistance. This makes the ATS-09E-50-C1-R0 a great option for applications that require reliable thermal management.
The ATS-09E-50-C1-R0 is a cost-effective solution for thermal management in high-temperature applications. It is proven to be highly reliable and offers excellent performance. With its lightweight and compact design, the ATS-09E-50-C1-R0 is an ideal choice for applications that require reliable heat dissipation and improved performance and reliability of electronic components.
The specific data is subject to PDF, and the above content is for reference