ATS-09H-195-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-09H-195-C1-R0-ND

Manufacturer Part#:

ATS-09H-195-C1-R0

Price: $ 3.13
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X12MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-09H-195-C1-R0 datasheetATS-09H-195-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 2.81736
30 +: $ 2.74134
50 +: $ 2.58905
100 +: $ 2.43671
250 +: $ 2.28446
500 +: $ 2.20830
1000 +: $ 1.97985
Stock 1000Can Ship Immediately
$ 3.13
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.472" (12.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 10.88°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks are a form of cooling device typically used on electronic components to dissipate the heat that they generate during operation. The heat sink works by providing a large surface area for heat to dissipate. This large area allows the heat to be spread out over a larger area and helps to reduce the hot spot temperature on the device. There are a variety of different heat sink designs available, including the ATS-09H-195-C1-R0.

The ATS-09H-195-C1-R0 is a thermal heat sink designed to provide cooling for a variety of electronic components. It features a unique design that utilizes a series of fins to increase the surface area and promote efficient heat dissipation. The heat sink is composed of aluminum, which is a highly efficient material for heat dissipation because it has a high thermal conductivity. The aluminum fins are also coated with a special finish that improves the heat dissipation characteristics.

The working principle of the ATS-09H-195-C1-R0 is based on the concept of heat transfer. Heat energy is transferred from the hot surface of the device to the fins of the heat sink. This transfer occurs due to the fact that the aluminum material has a much lower heat capacity than the device itself. This allows the heat to transfer from the device, through the aluminum, and eventually dissipate into the surrounding environment.

The ATS-09H-195-C1-R0 has a wide range of possible applications. It can be used with any type of computer processor, video card, and other electronic components. The device is also suitable for cooling applications in data centers or other special environments. Further, it can be used to cool industrial machinery and other electronic components that generate heat. With its efficient heat transfer capabilities, it is an ideal choice for a variety of cooling applications.

In conclusion, the ATS-09H-195-C1-R0 is a highly efficient heat sink designed to provide cooling for a variety of electronic components. It utilizes a series of fins to increase the surface area and promote efficient heat dissipation. The working principle of the device is based on the concept of heat transfer, where heat energy is transferred from the hot surface of the device, through the aluminum fins, and eventually dissipate into the surrounding environment. With its wide range of possible applications and efficient cooling capabilities, it is an ideal choice for a variety of cooling needs.

The specific data is subject to PDF, and the above content is for reference

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