ATS-10B-05-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-10B-05-C1-R0-ND

Manufacturer Part#:

ATS-10B-05-C1-R0

Price: $ 3.45
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X25MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-10B-05-C1-R0 datasheetATS-10B-05-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.13866
30 +: $ 3.05361
50 +: $ 2.88401
100 +: $ 2.71435
250 +: $ 2.54470
500 +: $ 2.45987
1000 +: $ 2.20541
Stock 1000Can Ship Immediately
$ 3.45
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 8.69°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The ATS-10B-05-C1-R0 is a thermal – heat sink product solution from TE Connectivity. It utilizes a standard, industry recognized construction and enclosure that allows for superior performance through the flexibility of rectilinear fins. These fins can be adjusted to accommodate any thermal environment and provide the best possible air flow velocity across their surfaces.

TE Connectivity’s ATS-10B-05-C1-R0 heat sink gives design engineers the opportunity to use the latest technology when creating efficient heat sinks for a wide variety of applications. It consists of a series of durable rectilinear fins made from aluminum. The fins are mounted on the central heat sink base by a standard clip system, and are designed to maintain optimal thermal performance, even in thermal environments that vary widely by season or geographical location.

The aluminum fins used in the ATS-10B-05-C1-R0 are designed to optimize air flow velocities over their surfaces, allowing them to dissipate more heat than standard heat sinks. This results in greater efficiency and improved performance. Moreover, the fins can be adjusted to match any thermal environment, providing added flexibility.

In addition to its superior thermal design, the ATS-10B-05-C1-R0 also features a low-profile enclosure. This minimizes the amount of clearance needed for installation and allows it to easily fit into tight spaces. Furthermore, the enclosure is ergonomically designed and has smooth leatherette surface treatment to ensure user comfort.

The ATS-10B-05-C1-R0 thermal – heat sink from TE Connectivity is the ideal solution for any application requiring efficient heat dissipation and superior thermal performance. Its standard, industry-recognized construction and enclosure allows for maximum flexibility, while its rectilinear fins and low-profile enclosure make it an ideal fit for any thermal environment.

The specific data is subject to PDF, and the above content is for reference

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