| Allicdata Part #: | ATS-10D-109-C3-R1-ND |
| Manufacturer Part#: |
ATS-10D-109-C3-R1 |
| Price: | $ 5.17 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X40X9.5MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10D-109-C3-R1 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.65003 |
| 30 +: | $ 4.39152 |
| 50 +: | $ 4.13318 |
| 100 +: | $ 3.87488 |
| 250 +: | $ 3.61655 |
| 500 +: | $ 3.35823 |
| 1000 +: | $ 3.29365 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.374" (9.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 27.79°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal-heat sinks are essential components in electronic device cooling systems due to their ability to efficiently dissipate heat generated by electronic components. The ATS-10D-109-C3-R1 is a thermal-heat sink of the latest generation designed to effectively support cooling in components used in highly efficient and high-powered electronic devices. This report will describe the application field of the ATS-10D-109-C3-R1 and its working principle in more detail.
The ATS-10D-109-C3-R1 is a two-stage heat sink and is classed as an advanced thermal solution. It is designed for applications requiring high cooling power, such as computers, other data processing and telecommunications equipment, and industrial control equipment. With a lightweight aluminum construction, the product is ideal for use where weight and space are limited, as it offers an effective cooling solution without sacrificing portability.
The ATS-10D-109-C3-R1 offers superior cooling performance with a low acoustic profile. Its advanced design features two heat sink fins that are connected by a continuous rail system, which increases the amount of air that is circulated and reduces the amount of noise created by the heat sink. This feature also allows the product to operate at optimal temperatures even in environments with limited airflow.
The working principle of the ATS-10D-109-C3-R1 is based on the principle of thermodynamics. Heat is generated within electronic components, and this heat must be dissipated in order for the component to remain functional. With the ATS-10D-109-C3-R1, the heat generated by the components is first absorbed by the aluminum fins of the heat sink and then transferred to the surrounding air. This is done using a process of convection in which air is drawn into the fins by the fan and then heated by the fins. This heated air then passes through the fan and is released into the environment, effectively cooling the components.
The ATS-10D-109-C3-R1 offers a reliable and efficient cooling solution for a variety of electronic components. Its lightweight construction and low noise profile make it an ideal choice for applications where portability and noise are factors. It also offers superior cooling performance compared to other heat sinks, making it an excellent choice for applications that require high cooling power. In summary, the ATS-10D-109-C3-R1 is an excellent thermal-heat sink that offers superior cooling performance and a low acoustic profile.
The specific data is subject to PDF, and the above content is for reference