| Allicdata Part #: | ATS17894-ND |
| Manufacturer Part#: |
ATS-10F-08-C2-R0 |
| Price: | $ 3.94 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X15MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10F-08-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.57840 |
| 10 +: | $ 3.48138 |
| 25 +: | $ 3.28810 |
| 50 +: | $ 3.09481 |
| 100 +: | $ 2.90134 |
| 250 +: | $ 2.70791 |
| 500 +: | $ 2.51449 |
| 1000 +: | $ 2.46614 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 14.61°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
The ATS-10F-08-C2-R0 is a type of thermal heat sink that has found major applications in the electronics industry. Heat sinks are designed to increase surface area to dissipate heat, counter over-heating, and prevent electronic components from operating outside of their designed parameters.
Features and Benefits
The ATS-10F-08-C2-R0 offers a range of features that provide a number of useful benefits for users. This heat sink specifically is optimized for easy integration into systems, such as requiring fewer assembly steps for installation. Additionally, its design ensures maximum airflow through its fins, which allowing it to maintain its performance levels over time. The heat sink also offers a range of coolant options, including air or liquid, and featuring options for controlling the speed of the fan.
Application Field and Working Principle
The ATS-10F-08-C2-R0 can be used in a variety of electronic applications, including in telecommunications systems, data centers, and medical equipment. Heat sinks are typically designed to dissipate heat that is generated by electronic components, such as transistors or other semiconductors. The ATS-10F-08-C2-R0 works by transferring the heat from the component to the heat sink’s fins via contact thermal resistance. This effectively cools down the component, preventing the component from over-heating and preventing hardware failure. With most heat sinks, this thermal transfer is enhanced with a heat transfer fluid such as liquid or air.
Conclusion
The ATS-10F-08-C2-R0 is an ideal heat sink for those needing a reliable and effective cooling solution. It offers a number of features such as the ability to select from a range of coolants, and optimization for easier integration into systems. Additionally, due to its robust design, the ATS-10F-08-C2-R0 can remain effective even after long periods of usage. As such, the ATS-10F-08-C2-R0 can provide a reliable and efficient cooling solution for electronic components.
The specific data is subject to PDF, and the above content is for reference