| Allicdata Part #: | ATS-10F-20-C1-R0-ND |
| Manufacturer Part#: |
ATS-10F-20-C1-R0 |
| Price: | $ 3.99 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10F-20-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.62061 |
| 30 +: | $ 3.41922 |
| 50 +: | $ 3.21817 |
| 100 +: | $ 3.01701 |
| 250 +: | $ 2.81588 |
| 500 +: | $ 2.61474 |
| 1000 +: | $ 2.56446 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.13°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-10F-20-C1-R0 is a thermal heat sink that is widely used in the telecom and IT industries. It is a compact but robust thermal management device designed to dissipate and control the heat generated by high-power electronics, computer and communication applications. This heat sink is designed with a special flange design for easy installation, and can also be used in air-cooled and liquid-cooled systems.
The ATS-10F-20-C1-R0 can dissipate in excess of more than 300,000 BTUs of thermal energy per hour, making it a powerful and efficient heat sink choice for almost any application. It is designed to be used in a variety of working environments from hot, humid and corrosive to cold, dry and dusty. The thermal performance of the ATS-10F-20-C1-R0 is superior to any other type of thermal heat sink available on the market today.
The working principle of the ATS-10F-20-C1-R0 thermal heat sink is based on the natural convection of air in order to dissipate heat. The heat sinks are mounted on the component which generates the heat. Heat is then conducted from the component to the heat sink through either a physical or thermal interfaces, such as thermal pads or heat pipes. Once the heat is conducted to the heat sink, natural convection takes over and dissipates the heat away from the component. The air around the heat sink also helps to dissipate the heat.
The ATS-10F-20-C1-R0 thermal heat sink has a wide range of applications, ranging from high-density electronic systems to servers, and industrial components. It can be used in both air-cooled and liquid-cooled systems, and can be used in a variety of applications such as computers, communications and telecom systems, and industrial machinery. This thermal heat sink is also used in the automotive and aerospace industry, and is often used in the manufacture of consumer electronics.
The ATS-10F-20-C1-R0 thermal heat sink is easy to install and requires minimal maintenance. It is also a cost-effective solution for dissipating heat from high-powered computer and communication systems. This thermal heat sink is designed to provide excellent thermal performance in a wide range of working environments.
The specific data is subject to PDF, and the above content is for reference