ATS-10G-20-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.126" (54.01mm)
Width:	2.126" (54.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	7.21°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Application Field and Working Principle of ATS-10G-20-C3-R0 Thermal - Heat Sinks

Thermal - Heat Sinks are mechanical devices that transfer thermal energy generated by a computer processor or other electronic components, typically with the addition of surface area and using airflow provided by fans. The ATS-10G-20-C3-R0 thermal - heat sinks are engineered with a high quality copper alloy for superior performance. The base of the heat sink can easily disperse heat away from the components while the fins allow strong thermal conductivity of air for better heat dissipation.

Components

The ATS-10G-20-C3-R0 Thermal Heat Sink consists of the following components: a copper base plate, heat fins, and a heat sink bracket. The copper base plate is used to conduct the heat away from the processor or other components, while the heat fins increase the surface area to allow the thermal conductivity to be greater. The heat sink bracket is used to secure the heat sink to the processor or component, while also creating a path for air to flow through, which helps to dissipate the thermal energy generated.

Application Field

The ATS-10G-20-C3-R0 is designed for use in laptops, desktops, tablets, and embedded processing designs. This thermal heat sink is designed to be used in applications where maximum cooling efficiency is required. It can handle up to 15 W of thermal energy, making it an excellent choice for use in high-output processors and embedded processors. The ATS-10G-20-C3-R0 has a low profile design which allows it to offer superior cooling performance compared to other thermal heat sinks.

Working Principle

The working principle of the ATS-10G-20-C3-R0 thermal heat sink is based on the principles of thermodynamics. The heat emitted by the processor or other components is conducted through the copper base plate and then transferred to the heat fins. The heat fins increase the surface area, providing a larger area for dissipating the thermal energy. The air provided by the fan then passes through the heat fins, which absorbs the heat. The accelerated air then passes through the heat sink bracket, transferring the heat away from the processor or component.

Benefits

The ATS-10G-20-C3-R0 thermal heat sink offers many benefits over other cooling solutions. It is lightweight and easily installed, making it an excellent choice for use in laptop and embedded processor designs. The copper alloy base plate conducts thermal energy efficiently, and the heat fins provide increased surface area for maximum heat dissipation. The low profile design of the ATS-10G-20-C3-R0 ensures compatibility with most processors and components. Moreover, the heat sink is designed for low noise operation, allowing it to be used in a variety of settings without disruption.

Conclusion

The ATS-10G-20-C3-R0 thermal heat sink is an excellent choice for cooling applications in laptops, desktops, tablets, and embedded processor designs. It is lightweight and easily installed, while its low-profile design ensures compatibility with most CPUs and GPUs. The copper alloy base plate and heat fins offer excellent thermal conductivity, ensuring maximum heat dissipation. The ATS-10G-20-C3-R0 thermal heat sink is designed for low noise operation, making it an ideal solution for a variety of applications.

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