| Allicdata Part #: | ATS-10H-05-C3-R0-ND |
| Manufacturer Part#: |
ATS-10H-05-C3-R0 |
| Price: | $ 3.85 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10H-05-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.49524 |
| 30 +: | $ 3.40074 |
| 50 +: | $ 3.21174 |
| 100 +: | $ 3.02280 |
| 250 +: | $ 2.83387 |
| 500 +: | $ 2.73940 |
| 1000 +: | $ 2.45602 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.84°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks are used to dissipate large amounts of heat from electronic components in order to keep them within their operating temperature ranges. ATS-10H-05-C3-R0 is a thermal heat sink designed to dissipate heat generated by devices such as circuit boards, CPUs and other high-power components. The ATS-10H-05-C3-R0 is a highly efficient device that can be used in a wide range of applications.
The ATS-10H-05-C3-R0 is a heat sink with a profile depth of 10mm and height of 5mm. It features a unique copper core design that allows for efficient heat transfer from the device to the heat sink. This copper core design allows the ATS-10H-05-C3-R0 to dissipate heat at a much higher rate than other conventional heat sinks. Additionally, the ATS-10H-05-C3-R0 is constructed with a robust aluminum case for additional protection and durability.
The ATS-10H-05-C3-R0 can be used in a variety of industrial settings. It is designed to provide superior thermal performance for high-power components in areas such as telecommunications, industrial automation, medical systems, lighting systems, and computer systems. The ATS-10H-05-C3-R0 is ideal for situations where space is limited and the application is expected to generate significant levels of heat.
The ATS-10H-05-C3-R0 operates on the principle of heat conduction. Heat conduction is the process of transferring heat between two objects that are in contact with each other. In a heat sink, heat is conducted from the device to the heat sink through the direct contact between the two components. As the heat is conducted away from the device, it is dissipated into the surroundings, preventing the device from becoming too hot.
The ATS-10H-05-C3-R0 heat sink is an efficient solution for cooling high-power components and ensuring that their temperature remains within acceptable limits. The copper core design allows for fast and effective heat conduction, while the robust aluminum case provides durability and long-term performance. The ATS-10H-05-C3-R0 is ideal for a wide range of applications, allowing it to be used in both industrial and consumer settings.
The specific data is subject to PDF, and the above content is for reference