ATS-10H-115-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.575" (40.00mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.790" (20.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	5.33°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

• ATS-10H-115-C2-R0 Application Field and Working Principle

Thermal - Heat Sinks are an essential tool for any heat-generating applications. The ATS-10H-115-C2-R0 is a particular type of heat sink designed to aid in the dissipation of heat generated from microelectronic devices. As such, they are widely used in many industries and applications. This article will discuss the application fields and working principles of the ATS-10H-115-C2-R0 heat sink.

What is the ATS-10H-115-C2-R0?

The ATS-10H-115-C2-R0 is a type of thermal - heat sink designed to dissipate and regulate the heat produced from microelectronic components and devices. It is made up of an aluminum base, copper extrusions, fins made of aluminum, and a galvanized end plate. The fins and extrusions sit on the aluminum base, which then rests on the mounting bracket. The fins and extrusions are designed to provide airflow which helps dissipate the heat and reduce the surface temperature of the component or device. The galvanized end plate also helps enhance the heat dissipation performance.

What are the Application Fields of the ATS-10H-115-C2-R0?

The ATS-10H-115-C2-R0 can be used in a variety of application fields due to its efficient heat dissipation capabilities. It is commonly used in LED lighting applications, consumer electronics, automotive electronics, medical electronics, military electronics, power supplies, and LED drivers. It is also suitable for fluctuating temperature applications, such as those used in mining, ships, and other industrial applications. The ATS-10H-115-C2-R0 is able to dissipate large amounts of heat and remain cool under the harshest conditions.

How Does the ATS-10H-115-C2-R0 Work?

The ATS-10H-115-C2-R0 works by diverting and dissipating heat away from the heated component or device. The fins, extrusions, and end plate are designed to create an airflow, allowing the heat to escape the component or device and be carried away by the surrounding airflow. This helps to keep the component or device cool and prevents it from overheating. The aluminum base and fins also help to dissipate heat by absorbing it. The heat will then be dissipated through convection, while the aluminum fins and extrusions also act as a heat conducting element. This helps to further minimize the temperature of the component or device.

Conclusion

The ATS-10H-115-C2-R0 is an effective and efficient thermal - heat sink designed to help dissipate the heat generated from microelectronic components and devices. It has a range of application fields and works by creating an airflow and dissipating heat through convection, absorption, and conduction. This helps keep the component or device cool and prevents it from overheating, making it an ideal solution for any heat-generating applications.

The specific data is subject to PDF, and the above content is for reference