| Allicdata Part #: | ATS-10H-12-C3-R0-ND |
| Manufacturer Part#: |
ATS-10H-12-C3-R0 |
| Price: | $ 3.93 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X12.7MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10H-12-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.57399 |
| 30 +: | $ 3.37554 |
| 50 +: | $ 3.17696 |
| 100 +: | $ 2.97845 |
| 250 +: | $ 2.77989 |
| 500 +: | $ 2.58133 |
| 1000 +: | $ 2.53168 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.93°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks are designed to dissipate heat from electronic components and circuits. The ATS-10H-12-C3-R0 heat sink is a component that can be used to help with cooling the high-powered components within an electronics device. The ATS-10H-12-C3-R0 has a compact fin design and thermal-grade aluminum construction that deliver excellent cooling performance. The heat sink is designed to mount directly on the electronic component, and its fin arrangement provides improved air flow.
In order to adequately transfer heat from the electronics component to the air surrounding it, the heat sink must have a good thermal conductivity. The ATS-10H-12-C3-R0 heat sink is designed with a sophisticated fin design that provides a large heat surface area, which enables efficient heat transfer. The fins are also spaced in a special pattern to provide better air circulation and increased cooling efficiency. The fins are made of an aluminum alloy with a silver-plated finish that exhibits good thermal conductivity and corrosion resistance.
The ATS-10H-12-C3-R0 heat sink is designed to be mounted directly on the electronic component. The fins are designed to quickly dissipate the heat generated by the electronics component. This helps to reduce the temperature of the component and ensure that the electronics operate safely and reliably. The ATS-10H-12-C3-R0 is designed to be compatible with standard mounting hole sizes, making it easy to install on the component.
The ATS-10H-12-C3-R0 heat sink can be used in a variety of applications, such as computers, cell phones, consumer electronics, appliances, and automotive electronics. The ATS-10H-12-C3-R0 is particularly suited for use in electronic devices with high power requirements. The heat sink\'s large thermal conductivity and durable construction make it an ideal choice for applications with high-powered components.
The ATS-10H-12-C3-R0 heat sink offers the best performance and longevity when installed in devices that use high-power components. With its efficient thermal transfer and robust construction, the ATS-10H-12-C3-R0 is a reliable choice for cooling these components. The ATS-10H-12-C3-R0 is an excellent choice for many different applications, and its simple installation makes it an easy choice for most users.
The specific data is subject to PDF, and the above content is for reference