| Allicdata Part #: | ATS18332-ND |
| Manufacturer Part#: |
ATS-10H-136-C2-R0 |
| Price: | $ 7.88 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X25MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10H-136-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 7.08750 |
| 10 +: | $ 6.69627 |
| 25 +: | $ 6.30252 |
| 50 +: | $ 5.90877 |
| 100 +: | $ 5.51477 |
| 250 +: | $ 5.12089 |
| 500 +: | $ 5.02240 |
| 1000 +: | $ 4.92392 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 2.18°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are essential components of electronic equipment, providing efficient conduction and dissipation of excess heat generated by the internal components. Heat Sinks are used to balance the thermal requirements of the system, which helps keep temperatures in the safe operating range, and prevent the components from overheating and potentially causing damage. The ATS-10H-136-C2-R0 is a high-performance Heat Sink manufactured to the highest industry standards for dependable and reliable service.
The ATS-10H-136-C2-R0 is a 2-piece rectangular Heat Sink with a large base. It is made from high-thermal-conductivity aluminum alloy materials, which provide excellent cooling performance. The Heat Sink has a thin wall, making it lightweight and suitable for applications where space-constraints are an issue. It features a flat fin design that maximizes surface area, allowing for better dissipation of heat, and a baffled base channel for increased efficiency.
The ATS-10H-136-C2-R0 is suitable for various applications within the industrial, medical and consumer sectors, such as LED, i7/i5/i3/Sandy Bridge CPUs, and other electronic devices. It can also be used to cool off power supplies, controllers, amplifiers, and FPGAs. The Heat Sink is designed to effectively dissipate heat away from sensitive components, ensuring that they operate within their safe operating temperature range.
The ATS-10H-136-C2-R0 Heat Sink utilizes natural convection to dissipate heat away from the electrical components. The Heat Sink features a wide surface area and multiple channels that produce enhanced airflow. As the ambient air enters the Heat Sink, it takes the heat away from the component and exits out of the Heat Sink. This process helps to keep the temperature of the component within the safe operating range and prevents any damage caused due to overheating.
The ATS-10H-136-C2-R0 Heat Sink also features snap-in mounting options, making it easy to install onto existing boards. It is highly reliable and provides superior performance for a wide range of applications. With its lightweight design, high-thermal-conductivity material, and innovative baffled base channel, the ATS-10H-136-C2-R0 Heat Sink is ideal for applications that require efficient heat dissipation and protection of sensitive components.
The specific data is subject to PDF, and the above content is for reference