| Allicdata Part #: | ATS18340-ND |
| Manufacturer Part#: |
ATS-10H-143-C2-R0 |
| Price: | $ 3.95 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X20MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10H-143-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.55320 |
| 10 +: | $ 3.45933 |
| 25 +: | $ 3.36596 |
| 50 +: | $ 3.17898 |
| 100 +: | $ 2.99193 |
| 250 +: | $ 2.80496 |
| 500 +: | $ 2.71146 |
| 1000 +: | $ 2.43095 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.33°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal heat sinks are an essential component in the cooling process of electronic equipment. The ATS-10H-143-C2-R0 is a high performance, heat sink designed for applications such as power systems, processors, data centers, and servers. This article will discuss the application field and working principle of the ATS-10H-143-C2-R0 thermal heat sink.
The ATS-10H-143-C2-R0 thermal heat sink is designed to dissipate heat from any high-power electronic applications, such as computers, processors, and other electronic equipment. The advanced design of the ATS-10H-143-C2-R0 provides maximum thermal performance for the demanding requirements of these high-power applications. The ATS-10H-143-C2-R0 is constructed with a copper base and aluminum fins, and is designed for homogeneous sides and back-to-back applications.
The ATS-10H-143-C2-R0 uses an advanced thermal design to effectively dissipate heat away from the electronics. The design incorporates integrated heat-pipe channels connecting each fin to the next forming an array of long, thin radiators. This process facilitates The ATS-10H-143-C2-R0’s ability to effectively cool any high-power electronic components.
Another key feature of the ATS-10H-143-C2-R0 is its ability to be mounted in various configurations. The ATS-10H-143-C2-R0 can be mounted directly to the device or onto the object’s surface. The mounting method can be varied depending on the orientation of the device or particular needs of the application. It can also be flush mounted to reduce airflow resistance.
The ATS-10H-143-C2-R0 is designed for maximum heat dissipation. The large surface area helps to spread the heat across the entire device, which eliminates hot spots and reduces the overall temperature of the device. Additionally, the ATS-10H-143-C2-R0 is designed with vent holes which allow airflow through the interior of the device, further aiding in cooling the device.
The ATS-10H-143-C2-R0 has a number of advantages over other thermal heat sinks including its lightweight construction, superior heat-dissipation capabilities, and low profile design. The ATS-10H-143-C2-R0 is highly resistant to corrosion and will not rust in intense temperatures. Additionally, the ATS-10H-143-C2-R0 is designed with a height of only 15.3 mm, making it well suited for high-power electronics with tight form factors.
In conclusion, the ATS-10H-143-C2-R0 is an innovative thermal heat sink designed for the cooling of high-power electronics. Its large surface area, vent holes, and low profile design combine to make the ATS-10H-143-C2-R0 a highly efficient and reliable cooling option for any application. Its lightweight construction and superior heat-dissipation capabilities also make the ATS-10H-143-C2-R0 an ideal choice for applications with tight form factors.
The specific data is subject to PDF, and the above content is for reference