ATS-10H-147-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.378" (35.00mm)
Width:	1.378" (35.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	13.65°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Thermal management has become increasingly important in recent decades as the demand for higher power applications increases. An effective thermal management system is crucial for all electronic applications in order to ensure the system remains within the safe temperature ranges. One of the most common solutions in thermal management is the use of heat sinks which can be used to transfer heat away from components and regulate temperatures. The ATS-10H-147-C3-R0 is a heat sink designed to provide efficient thermal management for a variety of applications.

Applications of ATS-10H-147-C3-R0 Heat Sink

The versatile ATS-10H-147-C3-R0 heat sink is well-suited for a range of different power applications, particularly those that require efficient thermal management. This heat sink can be used in external and embedded systems, including those that use memory modules, multi-core processors, power modules or FPGAs. Due to its wide range of customisable features, it can be adapted for specific applications, such as military or medical electronics. It has also been designed to work effectively in a range of environmental conditions, including extreme temperatures, high levels of shock and vibration, as well as demanding weather conditions.

Components and Design

The ATS-10H-147-C3-R0 heat sink is constructed from a range of components, including a copper base, a shim, a frame, a thermal compound, and a fan. The base which is made from 95% pure, high-conductive copper, is designed to increase the contact area with the component and therefore increase the heat dissipation. Additionally, the copper base is designed to reduce the stress of mounting components and increase the heat dissipation by allowing air to pass between the base layer and the component. The frame is made from aluminium and helps to spread the heat homogeneously throughout the system. It also provides additional structural protection to the heat sink, ensuring it is able to resist shock and vibration.

Working Principle

The ATS-10H-147-C3-R0 heat sink works on the principle of thermal management. It utilises a combination of components to facilitate efficient transfer of heat away from components to its surface. The copper base increases the contact area between the heat sink and the component, allowing for the dissipation of heat. Additionally, the aluminium frame spreads the heat throughout the system, helping to regulate the temperatures. The final component is the fan which circulates cool air around the heat sink, reducing the temperature. This is often supplemented with a thermal paste between the component and the heat sink in order to increase the thermal contact area and improve heat transfer.

Conclusion

The ATS-10H-147-C3-R0 heat sink is an effective solution for efficient thermal management. This heat sink utilises a combination of components to transfer heat away from the components, ensuring that the system remains within safe temperatures. It has been designed for a wide range of applications, from memory modules and multi-core processors, to external and embedded systems. Its many customisable features mean that it can be adapted for specific requirements and environments, such as military or medical electronics. The ATS-10H-147-C3-R0 is a reliable heat sink, designed to provide more effective thermal management for a variety of power applications.

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