ATS-10H-156-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.575" (40.00mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	4.14°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Thermal-Heat Sinks are used to dissipate heat generated from the operation of electronic components. Heat sinks may be designed and shaped, to increase the thermal performance, for particular applications. These shapes are often engineered in metal materials such as aluminum or copper, and may include thermal fins, mechanical structures, louvers, and meshes. The ATS-10H-156-C2-R0 is a type of two-part heat sink that is commonly used for many industrial and commercial applications.

ATS-10H-156-C2-R0 Application Fields and Working Principles

The ATS-10H-156-C2-R0 thermal heat sink is composed of two parts and is capable of dissipating up to 29.2 W/°C. It is designed for applications where maintaining low temperatures is a high priority, notably industrial and automotive electronic systems. Because of its robust components and design, it is capable of effectively dissipating heat from power circuits, as well as amplifier and DC-DC converter circuits. Additionally, it is also suitable for the cooling of RF components, such as low noise amplifier (LNA) and filters. The ATS-10H-156-C2-R0 consists of a base and a heat spreader, which are separated by the thermal interface material. The components are designed to be compatible with a wide range of circuit boards, allowing them to fit perfectly and ensure optimal thermal performance. The base is designed to dissipate heat away from the source, while the heat spreader helps to reduce the temperature of the entire system.

Thermal Performance and Dependability

The ATS-10H-156-C2-R0 thermal-heat sink has an average power dissipation rate of up to 29.2 W/°C and can operate in temperatures ranging from -40°C to +125°C. This allows for dependable performance in areas with extreme heat, such as a car’s engine compartment or a hot summer day. The ATS-10H-156-C2-R0 is designed with an effective thermal interface material. This allows the two components to be effectively cooled while also ensuring that there is no air gap between the base and heat spreader. This is essential for efficient heat transfer and ensures that the components remain cool even during prolonged use. Additionally, the thermal interface material is designed to be heat resistant and resistant to significant electrical and chemical changes.

Additional Features

The ATS-10H-156-C2-R0 thermal-heat sink is designed to support multiple configurations. This allows for the flexible installation of the components while allowing them to fit perfectly into the user’s system. Additionally, it offers low noise characteristics and is designed to produce minimal levels of electromagnetic interference. This is essential for preventing damage to sensitive circuits, particularly those used in medical or telecommunications systems. The ATS-10H-156-C2-R0 heat sink is also cost effective. Compared to other thermal-heat sink designs, the ATS-10H-156-C2-R0 provides superior thermal management and is tailored to provide the best possible solution at a cost-effective price.

Conclusion

The ATS-10H-156-C2-R0 thermal-heat sink is a highly reliable and efficient two-part thermal-heat sink designed for applications that require efficient heat dissipation. Featuring an effective thermal interface material, robust components, and low noise characteristics, it offers dependable performance in even the most extreme environments. Furthermore, its cost effectiveness allows users to easily create cost-effective and high-performance systems.

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