| Allicdata Part #: | ATS-10H-166-C3-R0-ND |
| Manufacturer Part#: |
ATS-10H-166-C3-R0 |
| Price: | $ 3.27 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X15MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10H-166-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.97234 |
| 30 +: | $ 2.89170 |
| 50 +: | $ 2.73105 |
| 100 +: | $ 2.57040 |
| 250 +: | $ 2.40975 |
| 500 +: | $ 2.32942 |
| 1000 +: | $ 2.08845 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.46°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management of electronic components is critical to ensure optimal performance in the most demanding applications. The ATS-10H-166-C3-R0 Heat Sink directly addresses this challenge by providing an efficient, robust and durable method of dissipating heat away from sensitive electronics. The device provides superior thermal conductivity and transfer capabilities at a competitive price with minimal design modifications required.
The ATS-10H-166-C3-R0 Heat Sink is an aluminum extrusion design featuring a fin density of 10 fins/inch and height of 166mm. The fins feature two fin styles, a rounded and flat-style fin for increased air flow. The device is made of high-grade aluminum and is resistance to corrosion and impact damage. The device includes a pre-taped thermal interface material (TIM) to ensure efficient heat transfer between the device and the electronic components.
The ATS-10H-166-C3-R0 is designed for a wide range of applications, including high-performance processors, resistors, diodes, transistors and heat-generating electronics. Typical applications include the medical, automotive, aerospace and consumer electronics industries. The device has a maximum power rating of 40 Watts and a thermal resistance of 0.38°C/W. This makes it suitable for operation in temperatures ranging from -40°C to +125°C.
The ATS-10H-166-C3-R0 Heat Sink uses a cross-flow design that provides excellent thermal stability and an increased thermal efficiency. The fin design utilizes a louver effect that efficiently captures and channels air for efficient heat dissipation. This design also minimizes air flow turbulence, providing a quieter operation and reduced power consumption. The device also features an integrated heat spreader that helps to evenly distribute heat across the entire fins surface.
The ATS-10H-166-C3-R0 Heat Sink is a reliable and cost-effective solution for thermal management applications. The device’s high thermal efficiency ensures that the components stay within their maximum temperature limit. The pre-taped TIM layer also simplifies installation as no additional thermal compound is required. Additionally, the device is compatible with a wide range of CPU and GPU cooling fan modules, enabling easy thermal management system customization.
The specific data is subject to PDF, and the above content is for reference