| Allicdata Part #: | ATS18376-ND |
| Manufacturer Part#: |
ATS-10H-176-C2-R0 |
| Price: | $ 4.03 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X15MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10H-176-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.66030 |
| 10 +: | $ 3.56265 |
| 25 +: | $ 3.36470 |
| 50 +: | $ 3.16676 |
| 100 +: | $ 2.96881 |
| 250 +: | $ 2.77089 |
| 500 +: | $ 2.57297 |
| 1000 +: | $ 2.52349 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.59°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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ATS-10H-176-C2-R0 APPLICATION FIELD AND WORKING PRINCIPLE
Thermal - Heat Sinks are designed to dissipate heat from electrical components and protect them from overheating. They use a combination of heat dissipation material and design to provide a highly effective cooling solution, while remaining both cost-effective and functional. The ATS-10H-176-C2-R0 is an example of a highly specialized heat sink designed for a specific application.
The ATS-10H-176-C2-R0 is specifically designed to provide cooling for high-powered transistors, power semiconductors, and other similar devices that generate large amounts of heat during operation. It features two layers of heat dissipation: copper fins and a perforated aluminum plate. The fins are grooved to promote better airflow, while the aluminum plate helps dissipate the heat even more efficiently.
The ATS-10H-176-C2-R0 can effectively dissipate up to 17 watts of heat, making it an ideal solution for high-powered devices. It can also fit into tight spaces and has a small profile, making it a great option for many applications.
In terms of working principle, the ATS-10H-176-C2-R0 relies on a combination of convection and conduction to dissipate heat. Heat is generated by the device and is then transferred to the heat sink through either conduction or convective heat transfer. The heat sink then disperses the heat away from the device to keep it from overheating.
The ATS-10H-176-C2-R0 has been designed with a specific purpose in mind: to provide effective cooling for high-powered transistors, power semiconductors, and other similar devices. It is an excellent choice for this type of application because of its highly efficient cooling capabilities and its ability to fit into tight spaces. Its cost-effectiveness, combined with its performance, make the ATS-10H-176-C2-R0 an ideal choice for many applications.
The specific data is subject to PDF, and the above content is for reference