ATS-10H-19-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-10H-19-C3-R0-ND

Manufacturer Part#:

ATS-10H-19-C3-R0

Price: $ 4.49
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 54X54X20MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-10H-19-C3-R0 datasheetATS-10H-19-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 4.03704
30 +: $ 3.81255
50 +: $ 3.58823
100 +: $ 3.36401
250 +: $ 3.13974
500 +: $ 2.91548
1000 +: $ 2.85942
Stock 1000Can Ship Immediately
$ 4.49
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.126" (54.01mm)
Width: 2.126" (54.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.790" (20.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 9.84°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Thermal - Heat Sinks

The ATS-10H-19-C3-R0 is a thermal-heat sink is designed to effectively dissipate thermal energy. It is primarily used in high thermal load applications, such as electronic components. Heat sinks are designed to reduce the temperature of the components that are part of a system. This helps to prevent them from overheating, which can cause damage and lead to substandard system performance. The ATS-10 heat sink is a very reliable and effective heat dissipating solution.

The ATS-10H-19-C3-R0 has excellent heat-dissipating capabilities and can be used in a broad range of applications and industries. It is designed to work with a variety of electronic components, such as transistors, resistors, and capacitors. It is also suitable for use in devices such as laptops, tablets, and mobile phones. In addition, it can be used in other areas such as commercial and industrial products, such as power supplies, air conditioners, and other machines. The ATS-10H-19-C3-R0 is designed to be highly efficient, which makes it a good choice for high thermal load applications.

The ATS-10H-19-C3-R0 utilizes mixed-mode technology to efficiently dissipate heat. It is comprised of a fin assembly, and copper-plated aluminum core, which is the primary heat dissipating mechanism. The mixed-mode system works by allowing air to circulate freely between the core and the fin assembly. This maximizes the efficiency of heat dissipating. Additionally, the copper-plated aluminum core is coated with a thermal-resistant coating, which helps to further improve the effectiveness of the ATS-10H-19-C3-R0.

The ATS-10H-19-C3-R0 is also designed to provide good value for money regarding its performance characteristics. It has a thermal resistance rating of 0.15C/W. This rating is considered to be relatively low, which means that the ATS-10H-19-C3-R0 can dissipate heat more effectively than other heat sinks. Furthermore, its design allows for easy installation and is cost efficient for many applications.

In conclusion, the ATS-10H-19-C3-R0 is a highly efficient thermal-heat sink designed primarily for use in high thermal load applications. It can be used with a wide range of electronic components and other applications. Its mixed-mode design ensures efficient heat dissipating and its general design and construction offer excellent value for money. Therefore, the ATS-10H-19-C3-R0 can be a great solution for many thermal-heat sink requirements.

The specific data is subject to PDF, and the above content is for reference

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