| Allicdata Part #: | ATS-10H-27-C1-R0-ND |
| Manufacturer Part#: |
ATS-10H-27-C1-R0 |
| Price: | $ 5.99 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X12.7MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10H-27-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.39028 |
| 30 +: | $ 5.09061 |
| 50 +: | $ 4.79128 |
| 100 +: | $ 4.49177 |
| 250 +: | $ 4.19232 |
| 500 +: | $ 3.89287 |
| 1000 +: | $ 3.81801 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.23°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-10H-27-C1-R0 is a thermal-heat sink designed to dissipate heat from electronic components. It is often used in power converters, computers, and other electronic devices. This type of heat sink uses passive airflow to dissipate the heat generated by the components.
As the thermal-heat sink is designed to dissipate heat from electronics components, it will generally be positioned around the component, or around the area where the heat is being generated. This is typically done by attaching the heat sink in a staggered pattern around the component, or the device itself. This allows for maximum efficiency with respect to dissipation of the heat generated. It also allows for minimal external component interference with the thermal-heat sink, as it can be positioned away from other components.
The main purpose of the ATS-10H-27-C1-R0 is to transfer heat away from the electronics components, thus protecting them from potential damage. The heat-sink does this by using a fan to create passive airflow surrounding the component. This airflow allows heat to be dissipated away from the component rather than trapped within. This is done by the fins on the heat-sink which increase the surface area for the airflow to travel, allowing increased dissipation of heat.
The ATS-10H-27-C1-R0 is designed to provide the best possible thermal performance, with minimum power consumption. It has the large surface area of fins, allowing it to dissipate heat quicker than other types of heat-sinks. It is also designed to reduce the amount of noise generated by the fan, allowing it to be used in quieter environments. It has a compact design, meaning it can be used in tight spaces without reducing the effectiveness of the thermal-heat sink.
The ATS-10H-27-C1-R0 is a highly efficient thermal-heat sink, and is often used in the electronics industry to dissipate heat from components. It is designed to provide maximum efficiency with minimal power consumption. The fan creates passive airflow, and the fins are designed to increase the surface area for the airflow to travel, allowing for increased dissipation of heat from the components.
The specific data is subject to PDF, and the above content is for reference