ATS-11A-06-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	20.17°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Thermal - Heat Sinks are one of the most important parts of any electronics device, whether it is in a computer, a video game console, or even a simple home appliance. These components help dissipate the heat created by the electronics device and keep it functioning properly. Without this heat dispersion, components could become damaged or even become irreversibly destroyed. The application of a heat sink, and the correct working principles behind it, is essential to the reliability and durability of any electronic device.In this article, we will be looking at the application field and working principle of the ATS-11A-06-C2-R0 heat sink. This particular heat sink is a commercially available heat sink which has been designed specifically for use in various electronics applications. It is designed to work efficiently with a variety of components and will help to ensure they maintain their optimal temperature range.

Application Field

The ATS-11A-06-C2-R0 heat sink has been designed for use in any number of applications. It is suitable for use in a variety of electronic devices, from computers and game consoles to home appliances such as heaters, air conditioners, and refrigerators. It is also suitable for use in many different types of electrical components, such as transistors, resistors, and capacitors.The ATS-11A-06-C2-R0 heat sink is also extremely versatile and can be used in a range of environmental conditions. It has been designed to withstand a wide temperature range, from -40 to +100°C, so it can be used in hot or cold environments. It also has a high tolerance for shock, vibration, and corrosion and can be used in a wide range of hazardous environments, from sandy deserts to dirty factories.

Working Principle

The ATS-11A-06-C2-R0 heat sink works on the principles of thermal conduction. This means that the heat generated by the electronic components is passed through the heat sink to the surrounding air. The heat sink helps to speed this process up by increasing the surface area of the component, so that more heat can quickly be dispersed into the surrounding air. It also helps to improve the thermal performance of the component by increasing the ability of the component to draw heat away quickly.The ATS-11A-06-C2-R0 heat sink also helps to protect the component from heat damage. Heat sinks are typically made from very durable materials, such as aluminum and copper, so they can withstand the heat generated by the component and keep them from becoming damaged.

Conclusion

The ATS-11A-06-C2-R0 heat sink is a versatile and highly effective thermal heat sink which can be used in a variety of electronics applications. It is designed to work efficiently and can help to ensure that components maintain their optimal temperature range. It is also extremely durable and can withstand a wide range of environmental conditions, ensuring that components remain protected from heat damage. By using the principles of thermal conduction, the ATS-11A-06-C2-R0 heat sink is able to disperse heat quickly and efficiently, allowing components to work safely and reliably.

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