| Allicdata Part #: | ATS18559-ND |
| Manufacturer Part#: |
ATS-11A-162-C2-R0 |
| Price: | $ 4.81 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11A-162-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.37220 |
| 10 +: | $ 4.25628 |
| 25 +: | $ 4.02016 |
| 50 +: | $ 3.78365 |
| 100 +: | $ 3.54715 |
| 250 +: | $ 3.31068 |
| 500 +: | $ 3.07420 |
| 1000 +: | $ 3.01508 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.62°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are a common type of thermal management component that is used in a wide range of applications. The ATS-11A-162-C2-R0 thermal management solution is a compact heat sink that combines active cooling with passive radiative cooling for efficient thermal management. This heat sink is suitable for a variety of applications, including industrial, commercial and consumer electronics.
At the core of the ATS-11A-162-C2-R0 thermal solution is a clever combination of active and passive cooling systems. The active cooling system uses specially designed heat transfer fins which are designed to efficiently spread heat away from the core components of the device. This heat is then dissipated from the surface of the fins which helps to reduce temperatures within the device.
The second component of the ATS-11A-162-C2-R0 thermal solution is the passive radiative cooling system. This system uses a combination of convection and radiation to help further dissipate heat away from the device. Convection helps to naturally draw heat away from the device, while radiation assists in cooling the fins by helping to prevent heat from radiating back onto the device. This passive cooling system is designed to ensure that the device remains at a stable temperature in all environmental conditions.
The ATS-11A-162-C2-R0 thermal solution provides a variety of benefits to its users. Firstly, it offers a compact form factor that is suitable for applications where space is a premium. Secondly, it provides a high level of cooling efficiency, helping to ensure that the device remains at a safe operating temperature. Thirdly, it offers a low cost and easy to install solution that can be implemented quickly and efficiently. Finally, it is a reliable and robust solution that is designed to last for a long time, making it a cost-effective investment.
The ATS-11A-162-C2-R0 thermal solution is suitable for a variety of applications and industries. It is especially suitable for applications such as consumer electronics, automotive, and industrial electronics where continuous operation is required. This heat sink is also suitable for applications where the heat generated is too high for air cooling solutions to effectively deal with. In such cases, the ATS-11A-162-C2-R0 thermal solution is an ideal choice.
The ATS-11A-162-C2-R0 thermal solution is an effective and efficient thermal management solution for a variety of applications. It combines active cooling and passive radiative cooling systems to provide efficient cooling and improved reliability. This solution is suitable for a variety of industries and applications where high levels of performance and reliability are required. It is a cost-effective solution that offers users a low installation cost, high cooling efficiency, and long-term reliability.
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