ATS-11B-166-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	0.984" (25.00mm)
Width:	0.984" (25.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.590" (15.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	12.46°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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ATS-11B-166-C3-R0 is a heat sink designed by Thermaltronics, mainly used in servers, Industry Control Systems (ICS), and other Industrial Internet of Things (IIoT) devices. The goal of the ATS-11B-166-C3-R0 is to provide effective thermal management to ensure that these systems function properly and remain operational despite high ambient temperatures.The ATS-11B-166-C3-R0 uses a combination of heat dissipation techniques to maximize the thermal performance of the device. Its design takes advantage of both convection and conduction. The convective heatsink provides airflow benefits while its conduction material efficiently dissipates heat across its surface area. This design ensures maximum cooling efficiency and reliability even during long hours of continuous operation.The ATS-11B-166-C3-R0 has a number of characteristics that makes it ideal for thermal management in critical applications. Its design has been optimized to provide a high level of cooling efficiency with minimal noise. It is also characterized by having an optimized area/size ratio, which leads to higher performance when compared to traditional designs. Additionally, its specialized design leads to improved thermal performance at higher temperatures, making it the ideal solution for heat dissipation in ICS and IIoT applications.The ATS-11B-166-C3-R0 is designed to be compact, durable, and light weight. It is constructed from high-quality aluminum for enhanced durability and rigidity. The aluminum also provides superior thermal properties and excellent electrical insulation properties. Its robust frame can also support high temperatures without any problems.The ATS-11B-166-C3-R0 is designed with an efficient thermal management system that ensures maximum heat dissipation with minimal noise. Its design includes a heat sink with a deep finned design consisting of arcs shaped for maximum air flow and cooling efficiency. Additionally, its fins are made with a special high-conductivity material which efficiently transfers heat away from its surface.The ATS-11B-166-C3-R0 is designed to be securely mounted at the top of a device. It is equipped with two mounting holes to allow for flexible installation in any type of device. Additionally, its bottom surface is designed for easy installation of fasteners, which ensures the thermal sink is firmly held and secured.The ATS-11B-166-C3-R0 is designed with a long-term service in mind. It has an extended service life of up to 10 years and is designed to withstand extreme temperature ranges. This makes it the ideal solution for high temperature and heavy-duty applications.The ATS-11B-166-C3-R0 is an effective thermal management solution designed for critical applications such as servers, ICS, and IIoT devices. Its design takes advantage of both convective and conduction cooling benefits in order to provide maximum cooling performance and reliable operation. Its compact and lightweight design ensures that it can be easily installed and securely mounted in any device. Additionally, its long-term service life makes it the ideal choice for use in heavy-duty and high temperature applications.

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