ATS-11C-16-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.126" (54.01mm)
Width:	2.126" (54.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	18.06°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal - Heat Sinks

Thermal – Heat Sinks are essential components in any application that needs to manage heat. One such product that has found wide applications is the ATS-11C-16-C1-R0. This product is geared towards the computing, medical, industrial and telecommunications industries, and its primary role is to maintain the balance between thermal management and device integrity. Let’s look at its application fields and working principles.

Application Fields

The ATS-11C-16-C1-R0 is an air-cooled aluminum based heat sink device that is designed for use in the above mentioned industries. It can be used to control temperatures for many types of applications, including CPUs, GPUs, FPGAs, power transistors and other electronics devices. It is also suitable for production processes such as die attach, wave soldering, and component packaging. This product is suitable for a range of climate conditions, with optimal functioning from -40°C to 105°C.

Working Principle

The ATS-11C-16-C1-R0’s working principle is relatively simple. It uses the efficient thermal management technique of air-cooling, relying on an airflow that is directed over the device to dissipate heat. This type of solution is beneficial for applications where there is limited space for cooling fans, or for components that must remain in an isolated environment, such as within a CPU. The device itself is made with an aluminum base and integrates copper fins and a heat spreader. This design allows for efficient heat conduction away from the hot spot.

Benefits

Thermal management with the ATS-11C-16-C1-R0 provides several benefits. First, it ensures that the electronic components are kept within the required temperature limits. It is also designed to meet standard requirements for efficiency, as it creates minimal noise with its low airflow operations. Finally, its lightweight and compact design make it a great choice for tight spaces.In summary, the ATS-11C-16-C1-R0 is an effective device for thermal management in a range of applications. It has excellent performance and reliability ratings, and is well-suited to today’s computing, medical, industrial and telecommunications industries. It provides reliable cooling with minimal noise, and its lightweight, compact design makes it easy to install in tight spaces. This product is sure to be a valuable addition to any project involving thermal management.

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