| Allicdata Part #: | ATS-12E-16-C3-R0-ND |
| Manufacturer Part#: |
ATS-12E-16-C3-R0 |
| Price: | $ 4.11 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X10MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12E-16-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.73590 |
| 30 +: | $ 3.52842 |
| 50 +: | $ 3.32098 |
| 100 +: | $ 3.11340 |
| 250 +: | $ 2.90584 |
| 500 +: | $ 2.69828 |
| 1000 +: | $ 2.64639 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.14°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are devices that are designed to disperse heat away from sensitive components. This heat transfer helps in cooling electronic components by using conduction, convection or radiation to allow the heat to dissipate into the surrounding air. The ATS-12E-16-C3-R0 heat sink is an effective thermal management solution and is commonly used in the electronics industry due to its durability and reliability. This article will discuss the application field and working principle of the ATS-12E-16-C3-R0 Heat Sink.
The ATS-12E-16-C3-R0 Heat Sink is designed for use in applications where reliable, high-performance heat transfer is essential. It is an ideal solution for cooling high power components such as CPUs, GPUs, and FPGAs. The ATS-12E-16-C3-R0 heat sink is also suitable for cooling DSPs, memory chips, microprocessors, laser diodes, and other high temperature electronics. In addition, the ATS-12E-16-C3-R0 Heat Sink is suitable for aerospace, defense, communication, optical fiber, and medical applications.
The ATS-12E-16-C3-R0 is constructed from aluminum and features a patented C-shaped fin pattern to maximize air flow and heat dissipation. The fin pattern is designed to increase surface area, allowing air to flow through the fins more easily. The heat sink is then coated with a black anodized finish to improve corrosion resistance. Additionally, the ATS-12E-16-C3-R0 heat sink is backed by a four-year warranty to ensure reliable operation.
The working principle of the ATS-12E-16-C3-R0 heat sink is based on the conduction of heat. Heat is conducted from the electronics component to the surface of the heat sink. Once the heat is transferred, the air flow around the fins helps to dissipate the heat via the process of convection. By utilizing both conduction and convection, the heat sink is able to transfer the heat away from the sensitive electronics components, keeping them cool and functioning properly.
In conclusion, the ATS-12E-16-C3-R0 heat sink is an effective thermal management solution that is designed for use in applications where reliable and efficient heat transfer is essential. It is constructed from aluminum and features a patented C-shaped fin pattern to maximize air flow and heat dissipation. The working principle of the ATS-12E-16-C3-R0 heat sink is based on the conduction and convection of heat. It is suitable for cooling a variety of high power components and is backed by a four-year warranty. The ATS-12E-16-C3-R0 heat sink is an ideal choice for thermal management applications and is a reliable and durable solution for the electronics industry.
The specific data is subject to PDF, and the above content is for reference