| Allicdata Part #: | ATS21028-ND |
| Manufacturer Part#: |
ATS-12E-73-C2-R0 |
| Price: | $ 3.45 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X10MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12E-73-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.13740 |
| 10 +: | $ 3.05550 |
| 25 +: | $ 2.97259 |
| 50 +: | $ 2.80753 |
| 100 +: | $ 2.64235 |
| 250 +: | $ 2.47724 |
| 500 +: | $ 2.39466 |
| 1000 +: | $ 2.14693 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 28.85°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an essential component of any electronic device. Accordingly, the proper selection and integration of heat sinks, fans, and other thermal solutions is essential to successful electronic design. Understanding the available options and their associated benefits and limitations is imperative. This article looks specifically at the ATS-12E-73-C2-R0 heatsink, addressing its areas of application as well as its working principles.
Application Fields
The ATS-12E-73-C2-R0 is an economical solution for cooling components such as CPUs, GPUs, transistors, and RF amplifiers. It is suitable for a variety of application fields, including telecommunications, consumer electronics, and automobiles. Furthermore, it is well suited for being used in areas with limited space thanks to its compact size, making it a popular choice among designers. The ATS-12E-73-C2-R0 supports a wide range of operating temperatures, from -20°C to +100°C, allowing it to be used in a variety of applications.
Working Principle
The ATS-12E-73-C2-R0 heatsink works by increasing the total surface area of the component to be cooled. This is achieved through the use of optimal fin designs such as open tubular fins and closed tube-fin structures. These fin designs allow for maximum convective heat transfer, which is the transfer of heat by air or liquid, from the component to the fin surfaces. The fin surfaces are loaded with nitrogen gas to ensure that the heat is transported efficiently. The ATS-12E-73-C2-R0 is designed to dissipate the generated heat to the surrounding environment cooling the component. By doing so, it reduces the components’ temperature to the desired levels.
Durability and Ease of Installation
The ATS-12E-73-C2-R0 heatsink has been designed to maintain its durability over time. This is due in part to its robust construction which is achieved by the use of aluminum or copper alloy materials which are resistant to corrosion. Additionally, this heatsink is lightweight, making it easy to install. The heatsink is also designed with an airtight design, ensuring that there are no possible air leaks which could lead to inefficient cooling. Moreover, the ATS-12E-73-C2-R0 has an optimized base design which features anti-corrosion materials, preventing the contact surfaces from degrading over time.
Conclusion
The ATS-12E-73-C2-R0 is an affordable and reliable thermal solution for cooling components such as CPUs and GPUs. Its application fields range from telecommunications to automobiles, and its wide temperature range allows for use in a variety of applications. Furthermore, its fin structures enable efficient convective heat transfer, and its robust construction ensures its durability over time. Lastly, its lightweight design and optimized base provide ease of installation, making the ATS-12E-73-C2-R0 a popular choice for designers.
The specific data is subject to PDF, and the above content is for reference